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Proceedings. 5th International Symposium on Quality Electronic Design

March 22 2004 to March 24 2004

San Jose, CA, USA

Table of Contents

[Copyright notice]Freely available from IEEE.pp. ii-ii
ISQED 2004Freely available from IEEE.pp. iii-iii
Welcome notesFreely available from IEEE.pp. xiv-xv
Steering/advisory committeeFreely available from IEEE.pp. xvii-xvii
Technical subcommitteesFreely available from IEEE.pp. xviii-xix
Conference at a glanceFreely available from IEEE.pp. xx-xx
Interconnect modelingFull-text access may be available. Sign in or learn about subscription options.pp. xxi-xxi
ManufacturabilityFull-text access may be available. Sign in or learn about subscription options.pp. xxii-xxii
Low-power designFull-text access may be available. Sign in or learn about subscription options.pp. xxii-xxii
Evening panel discussionFreely available from IEEE.pp. xxiii-xxv
Introduction
Welcome NotesFreely available from IEEE.pp. xv-xvi
Introduction
Organizing CommitteeFreely available from IEEE.pp. xvii
Introduction
Steering/Advisory CommitteeFreely available from IEEE.pp. xix
Introduction
Technical SubcommitteesFreely available from IEEE.pp. xx-xxi
Introduction
Conference at a GlanceFreely available from IEEE.pp. 3
ISQED Tutorials: Compact Modeling and Analysis for Nanometer-Scale CMOS Design
Tutorial Part 1: Nanometer-Scale CMOS DevicesFull-text access may be available. Sign in or learn about subscription options.pp. 7
ISQED Tutorials: Compact Modeling and Analysis for Nanometer-Scale CMOS Design
Tutorial Part 5: Coping with UncertaintyFull-text access may be available. Sign in or learn about subscription options.pp. 8
ISQED Panel Discussion EP1
Evening Panel Discussion: DFM PDK?s: Where Do They Belong To? Are Process Design Kits (PDKs) the Answer for Modern Design for Manufacturing (DFM) Issues?Full-text access may be available. Sign in or learn about subscription options.pp. 11-13
Plenary Session I
Simplify: Enable Quality, Enable InnovationFull-text access may be available. Sign in or learn about subscription options.pp. 17
Plenary Session I
Design for Manufacturing? Design for Yield!!!Full-text access may be available. Sign in or learn about subscription options.pp. 19
Plenary Session I
Why Nano Technology? Why Now? And What Might Its Impact on ElectronicsFull-text access may be available. Sign in or learn about subscription options.pp. 21
Session 1A: Physical Design Migration
Calligrapher: A New Layout Migration Engine Based on Geometric ClosenessFull-text access may be available. Sign in or learn about subscription options.pp. 25-30
Session 1A: Physical Design Migration
Methodology for Automated Layout Migration for 90 nm Itanium®2 Processor DesignFull-text access may be available. Sign in or learn about subscription options.pp. 31-35
Session 1A: Physical Design Migration
Automatic Generation of Standard Cell Library in VDSM TechnologiesFull-text access may be available. Sign in or learn about subscription options.pp. 36-41
Session 1B: CMOS Device and Memory
Leakage Increase of Narrow and Short BCPMOSFull-text access may be available. Sign in or learn about subscription options.pp. 51-54
Session 1B: CMOS Device and Memory
SRAM Leakage Suppression by Minimizing Standby Supply VoltageFull-text access may be available. Sign in or learn about subscription options.pp. 55-60
Session 1C: Poster Session
Transient Analysis of On-Chip Power Distribution Networks Using Equivalent Circuit ModelingFull-text access may be available. Sign in or learn about subscription options.pp. 63-68
Session 1C: Poster Session
Leveraging Delay Slack in Flip-Flop and Buffer Insertion for Power ReductionFull-text access may be available. Sign in or learn about subscription options.pp. 69-74
Session 1C: Poster Session
Moment Computations of Nonuniform Distributed Coupled RLC Trees with Applications to Estimating Crosstalk NoiseFull-text access may be available. Sign in or learn about subscription options.pp. 75-80
Session 1C: Poster Session
New Test Access for High Resolution SD ADC's by Using the Noise Transfer Function EvaluationFull-text access may be available. Sign in or learn about subscription options.pp. 81-85
Session 1C: Poster Session
Design for Testability of FPGA BlocksFull-text access may be available. Sign in or learn about subscription options.pp. 86-91
Session 1C: Poster Session
New Challenges Emerging on the Design of VLSI Circuits Made of MOSFETs Using New Gate Dielectric MaterialsFull-text access may be available. Sign in or learn about subscription options.pp. 92-97
Session 1C: Poster Session
Simultaneous Multiple-Vdd Scheduling and Allocation for Partitioned FloorplanFull-text access may be available. Sign in or learn about subscription options.pp. 98-103
Session 1C: Poster Session
Node Voltage Dependent Subthreshold Leakage Current Characteristics of Dynamic CircuitsFull-text access may be available. Sign in or learn about subscription options.pp. 104-109
Session 1C: Poster Session
Automated Formal Verification of Scheduling Process Using Finite State Machines with Datapath (FSMD)Full-text access may be available. Sign in or learn about subscription options.pp. 110-115
Session 1C: Poster Session
Transistor Level Budgeting for Power OptimizationFull-text access may be available. Sign in or learn about subscription options.pp. 116-121
Session 1C: Poster Session
Resistance Matrix in Crosstalk Modeling for Muliconductor SystemsFull-text access may be available. Sign in or learn about subscription options.pp. 122-125
Session 1C: Poster Session
Low Power 260 k Color TFT LCD One-Chip Driver ICFull-text access may be available. Sign in or learn about subscription options.pp. 126-130
Session 1C: Poster Session
Analysis and Reduction of On-Chip Inductance Effects in Power Supply GridsFull-text access may be available. Sign in or learn about subscription options.pp. 131-136
Session 1C: Poster Session
A Variable Reduction Technique for the Analysis of Ultra Large-Scale Power Distribution NetworksFull-text access may be available. Sign in or learn about subscription options.pp. 137-142
Session 1C: Poster Session
Rewiring for Watermarking Digital CircuitsFull-text access may be available. Sign in or learn about subscription options.pp. 143-148
ISQED Luncheon Speech
The IP Quality RevolutionFull-text access may be available. Sign in or learn about subscription options.pp. 151-155
Session 2A: Topics in Printability
Layout Printability Optimization Using a Silicon Simulation MethodologyFull-text access may be available. Sign in or learn about subscription options.pp. 159-164
Session 2A: Topics in Printability
A Pattern Matching System for Linking TCAD and EDAFull-text access may be available. Sign in or learn about subscription options.pp. 165-170
Session 2A: Topics in Printability
Shifting Methods: Adopting a Design for Manufacture FlowFull-text access may be available. Sign in or learn about subscription options.pp. 171-175
Session 2B: Package Design and Interaction
Design Tools for PackagingFull-text access may be available. Sign in or learn about subscription options.pp. 179-183
Session 2B: Package Design and Interaction
Robustness Enhancement through Chip-Package Co-Design for High-Speed ElectronicsFull-text access may be available. Sign in or learn about subscription options.pp. 184-189
Session 2B: Package Design and Interaction
Flip Chip Advanced Package Solder Joint Embrittlement Fault Isolation Using TDRFull-text access may be available. Sign in or learn about subscription options.pp. 190-195
Session 2B: Package Design and Interaction
A Clustering Based Area I/O Planning for Flip-Chip TechnologyFull-text access may be available. Sign in or learn about subscription options.pp. 196-201
Session 2C: Test Generation and Application
Low Power Testing by Test Vector Ordering with Vector RepetitionFull-text access may be available. Sign in or learn about subscription options.pp. 205-210
Session 2C: Test Generation and Application
Test Application Time Reduction for Scan Circuits Using Limited Scan OperationsFull-text access may be available. Sign in or learn about subscription options.pp. 211-216
Session 2C: Test Generation and Application
Functional Vector Generation for Combinational Circuits Based on Data Path Coverage Metric and Mixed Integer Linear ProgrammingFull-text access may be available. Sign in or learn about subscription options.pp. 217-222
Session 3A: Modeling and Simulations of Electromigration and Eletromagnetic Effect
Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene InterconnectFull-text access may be available. Sign in or learn about subscription options.pp. 225-231
Session 3A: Modeling and Simulations of Electromigration and Eletromagnetic Effect
A Methodology for Chip-Level Electromigration Risk Assessment and Product QualificationFull-text access may be available. Sign in or learn about subscription options.pp. 232-237
Session 3A: Modeling and Simulations of Electromigration and Eletromagnetic Effect
Circuit Level Reliability Analysis of Cu InterconnectsFull-text access may be available. Sign in or learn about subscription options.pp. 238-243
Session 3A: Modeling and Simulations of Electromigration and Eletromagnetic Effect
Modeling and Simulation of Circuit-Electromagnetic Effects in Electronic Design FlowFull-text access may be available. Sign in or learn about subscription options.pp. 244-249
Session 3B: Interconnect: Capacitance Extraction and Delay Calculation
A Divide-and-Conquer Algorithm for 3D Capacitance ExtractionFull-text access may be available. Sign in or learn about subscription options.pp. 253-258
Session 3B: Interconnect: Capacitance Extraction and Delay Calculation
A Comprehensive Analytical Capacitance Model of a Two Dimensional Nanodot ArrayFull-text access may be available. Sign in or learn about subscription options.pp. 259-264
Session 3B: Interconnect: Capacitance Extraction and Delay Calculation
Interconnect Mode Conversion in High-Speed VLSI CircuitsFull-text access may be available. Sign in or learn about subscription options.pp. 265-270
Session 3B: Interconnect: Capacitance Extraction and Delay Calculation
Efficient Capacitance Extraction for Periodic Structures by Shanks TransformationFull-text access may be available. Sign in or learn about subscription options.pp. 271-275
PARADE: parametric delay evaluation under process variation [IC modeling]Full-text access may be available. Sign in or learn about subscription options.pp. 276-280
Session 3C: Substrate Noise: Analysis and Prevention
Substrate Coupling: Modeling, Simulation and Design PerspectivesFull-text access may be available. Sign in or learn about subscription options.pp. 283-290
Session 3C: Substrate Noise: Analysis and Prevention
An Overview of Substrate Noise Reduction TechniquesFull-text access may be available. Sign in or learn about subscription options.pp. 291-296
Session 3C: Substrate Noise: Analysis and Prevention
Supply and Substrate Noise Tolerance Using Dynamic Tracking Clusters in Configurable Memory DesignsFull-text access may be available. Sign in or learn about subscription options.pp. 297-302
Session 3C: Substrate Noise: Analysis and Prevention
Modeling of Wave Behavior of Substrate Noise Coupling for Mixed-Signal IC DesignFull-text access may be available. Sign in or learn about subscription options.pp. 303-308
Session 3C: Substrate Noise: Analysis and Prevention
Estimating Phase-Locked Loop Jitter due to Substrate Coupling: A Cyclostationary ApproachFull-text access may be available. Sign in or learn about subscription options.pp. 309-314
IP industry: Nordstrom or K-Mart?Freely available from IEEE.pp. 317-319
Plenary Session II
Digitally Named World: Challenges for New Social InfrastructuresFull-text access may be available. Sign in or learn about subscription options.pp. 323
Plenary Session II
Designing High Quality, Scaleable SoC?s with Heterogeneous ComponentsFull-text access may be available. Sign in or learn about subscription options.pp. 325
Plenary Session II
Performance Limitations of Devices and Interconnects and Possible Alternatives for NanoelectronicsFull-text access may be available. Sign in or learn about subscription options.pp. 327
Session 4A: Interconnect Delay and Coupling
A Sensitivity Based Approach to Analyzing Signal Delay Uncertainty of Coupled InterconnectsFull-text access may be available. Sign in or learn about subscription options.pp. 331-336
Session 4A: Interconnect Delay and Coupling
Analytical Dynamic Time Delay Model of Strongly Coupled RLC Interconnect Lines Dependent on SwitchingFull-text access may be available. Sign in or learn about subscription options.pp. 337-342
Session 4A: Interconnect Delay and Coupling
A Scalable Communication-Centric SoC Interconnect ArchitectureFull-text access may be available. Sign in or learn about subscription options.pp. 343-348
Session 4B: Analysis of Variations
Application Specific Worst Case Corners Using Response Surfaces and Statistical ModelsFull-text access may be available. Sign in or learn about subscription options.pp. 351-356
Session 4B: Analysis of Variations
SPICE-Compatible Thermal Simulation with Lumped Circuit Modeling for Thermal Reliability Analysis Based on Modeling Order ReductionFull-text access may be available. Sign in or learn about subscription options.pp. 357-362
Session 4B: Analysis of Variations
Predicting Interconnect Uncertainty with a New Robust Model Order Reduction MethodFull-text access may be available. Sign in or learn about subscription options.pp. 363-368
ISQED04 best paper awardFreely available from IEEE.pp. 547-547
Session 4C: Layout and Design Techniques for Quality and Reliability
A High Performance SIMD Framework for Design Rule Checking on Sony?s PlayStation 2 Emotion Engine PlatformFull-text access may be available. Sign in or learn about subscription options.pp. 371-376
Session 4C: Layout and Design Techniques for Quality and Reliability
Exact Wiring Fault Minimization via Comprehensive Layout Synthesis for CMOS Logic CellsFull-text access may be available. Sign in or learn about subscription options.pp. 377-380
Session 4C: Layout and Design Techniques for Quality and Reliability
Buffered Clock Tree for High Quality IC DesignFull-text access may be available. Sign in or learn about subscription options.pp. 381-386
Session 5A: Analog Testing
Frequency Specification Testing of Analog Filters Using Wavelet Transform of Dynamic Supply CurrentFull-text access may be available. Sign in or learn about subscription options.pp. 389-394
Session 5A: Analog Testing
A Versatile High Speed Bit Error Rate Testing SchemeFull-text access may be available. Sign in or learn about subscription options.pp. 395-400
Session 5A: Analog Testing
Automated Test Generation and Test Point Selection for Specification Test of Analog CircuitsFull-text access may be available. Sign in or learn about subscription options.pp. 401-406
Session 5B: Low Power Design
Power Supply Optimization in sub-130 nm Leakage Dominant TechnologiesFull-text access may be available. Sign in or learn about subscription options.pp. 409-414
Session 5B: Low Power Design
Leakage Control Techniques for Designing Robust, Low Power Wide-OR Domino Logic for sub-130 nm CMOS TechnologiesFull-text access may be available. Sign in or learn about subscription options.pp. 415-420
Session 5B: Low Power Design
Low Power and High Performance Circuit Techniques for High Fan-In Dynamic GatesFull-text access may be available. Sign in or learn about subscription options.pp. 421-424
Session 5B: Low Power Design
Stacked FSMD: A Power Efficient Micro-Architecture for High Level SynthesisFull-text access may be available. Sign in or learn about subscription options.pp. 425-430
Session 5C: ESD
Low-Voltage-Triggered PNP Devices for ESD Protection Design in Mixed-Voltage I/O Interface with Over-VDD and Under-VSS Signal LevelsFull-text access may be available. Sign in or learn about subscription options.pp. 433-438
Session 5C: ESD
Full-Chip Analysis Method of ESD Protection NetworkFull-text access may be available. Sign in or learn about subscription options.pp. 439-444
Session 5C: ESD
Design to Avoid the Over-Gate-Driven Effect on ESD Protection Circuits in Deep-Submicron CMOS ProcessesFull-text access may be available. Sign in or learn about subscription options.pp. 445-450
Session 6A: DFM Design Techniques
Post Silicon Power/Performance Optimization in the Presence of ProcessVariations Using Individual Well Adaptive Body Biasing (IWABB)Full-text access may be available. Sign in or learn about subscription options.pp. 453-458
Session 6A: DFM Design Techniques
Concurrent Error Detection for Combinational and Sequential Logic via Output CompactionFull-text access may be available. Sign in or learn about subscription options.pp. 459-464
Session 6A: DFM Design Techniques
Cost Model Analysis of DFT Based Fault Tolerant SOC DesignsFull-text access may be available. Sign in or learn about subscription options.pp. 465-469
Session 6A: DFM Design Techniques
Managing Derivative SoC Design Projects to Better ResultsFull-text access may be available. Sign in or learn about subscription options.pp. 470-477
Session 6A: DFM Design Techniques
IPQ: IP Qualification for Efficient System DesignFull-text access may be available. Sign in or learn about subscription options.pp. 478-482
Session 6B: Delay Test Issues
Delay Fault Diagnosis Using Timing InformationFull-text access may be available. Sign in or learn about subscription options.pp. 485-490
Session 6B: Delay Test Issues
An Adaptive Path Delay Fault Diagnosis MethodologyFull-text access may be available. Sign in or learn about subscription options.pp. 491-496
Session 6B: Delay Test Issues
Scan BIST Targeting Transition Faults Using a Markov SourceFull-text access may be available. Sign in or learn about subscription options.pp. 497-502
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