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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Metal Contamination Evaluation of Via-Last Cu TSV Process Using Notchless Si Etching and Wet Cleaning of the First Metal Layer

Year: 2017, Pages: 655-660

DOI Bookmark: 10.1109/ECTC.2017.144

Authors

Naoya Watanabe
Hidekazu Kikuchi
Azusa Yanagisawa
Haruo Shimamoto
Katsuya Kikuchi
Masahiro Aoyagi
Akio Nakamura

Abstract