Abstract
This paper investigates the power module design for better common-mode (CM) EMI performance in a double sided cooling power module. The effect of parasitic capacitance on CM EMI is analyzed by using the CM equivalent model. To verify the analysis, a comparative study is conducted between a popular double sided cooling power module and a commercial wire bonded power module. The parasitic extraction results of ANSYS Q3D show that the double sided cooling power module faces more serve CM EMI issues due to the larger output-side capacitance. Simulation results also show that reasonable parasitic values and parameter symmetry can improve CM EMI performance. Based on the above studies, a design guidance of the double sided cooling power module are given for better CM EMI.