Abstract
Semiconductor memory failures depend on the behavior of its components. This paper deals with testing of defects occurring in the memory cells of a multi-port memory. We also consider the resistive shorts between word/bit lines of same and different ports of the memory. The memory is modeled at the transistor level and analyzed for electrical defects by applying a set of patterns. Not only have existing models been taken into account in our simulation but also a new fault model for the multi-port memory is introduced. The boundaries of failure for the proposed defects are identified.