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Proceedings
DTIP
DTIP 2003
Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on
Mixed system and component level T-CAD for micro fabrication
Year: 2003, Pages: 4-9
DOI Bookmark:
10.1109/DTIP.2003.1286999
Authors
U. Hansen
,
Inst. for Microtechnol., TU Braunschweig, Germany
C. Germer
S. Buttgenbach
H.J. Franke
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Abstract
