Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on
Design process supporting simulations on wafer level packages
DOI Bookmark: 10.1109/DTIP.2003.1287006
Authors
J.-P. Sommer, Dept. of Mech. Reliability & Micro Mater., Fraunhofer-Inst. for Reliability & Micro Integration, Berlin, GermanyO. Wittler, Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
D. Manessis, MEMSCAP, Crolles, France
B. Michel, MEMSCAP, Crolles, France