A new methodology for modeling MEMS Structures

Kaiping Zeng; Zhenyu Liu; J.G. Korvink

doi:10.1109/DTIP.2003.1287030

Previous
Next
Table of Contents

Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on

A new methodology for modeling MEMS Structures

Year: 2003, Pages: 170-175

DOI Bookmark: 10.1109/DTIP.2003.1287030

Authors

Kaiping Zeng, Inst. for Microsyst. Technol., Freiburg Univ., Germany
Zhenyu Liu, Inst. for Microsyst. Technol., Freiburg Univ., Germany
J.G. Korvink, Inst. for Microsyst. Technol., Freiburg Univ., Germany

A new methodology for modeling MEMS Structures

Authors

Abstract