Join Us
Sign In
My Subscriptions
Magazines
Journals
Video Library
Conference Proceedings
Individual CSDL Subscriptions
Institutional CSDL Subscriptions
Resources
Career Center
Tech News
Resource Center
Press Room
Advertising
Librarian Resources
IEEE.org
Help
About Us
Career Center
Cart
Create Account
Sign In
Toggle navigation
My Subscriptions
Browse Content
Resources
All
Previous
Next
Table of Contents
Related Articles
Home
Proceedings
ECTC
ECTC 2017
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
Assembly Challenges for 75x75mm Large Body FCBGA with Emerging High Thermal Interface Material (TIM)
Year: 2017, Pages: 130-135
DOI Bookmark:
10.1109/ECTC.2017.121
Authors
Fletcher Tung
Max Lu
Albert Lan
Steward Pan
Download PDF
SHARE ARTICLE
Generate Citation
Abstract
