Abstract
The continuing miniaturization and increasing power density of modern electronics make thermal-management a critical challenge for advanced materials used in electronic packaging field. As an important element of electronic packages, the thermal-conduction property of substrates plays an important role in heat removal. Polymer composites are commonly used in substrates because of their ease of large production, light weight, and excellent flexibility compared with ceramics. However, the traditional approaches to fabricating thermally conductive polymer composites usually suffer from a low thermal conductivity enhancement and/or the deterioration of mechanical property. In this study, using hexagonal boron nitride as thermally conductive filler and glass fibers as mechanically reinforced fillers liquid crystal epoxy composites, A kind of novel highly thermally conductive polymer composite that can be used as an organic substrate was prepared. The composite with a hexagonal boron nitride weight loading of 50 wt% exhibit the maximum in-plane and through-plane thermal conductivities of 5.85 and 1.60 W/m K, respectively. In addition, the polymer composites also possess good thermal stability, low dielectric permittivity, and excellent mechanical properties. This work provides a high thermally conductive organic substrate for advanced electronic packaging.