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ECTC
ECTC 2017

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Micro-Hermetic Packaging Technology for Active Implantable Neural Interfaces

Year: 2017, Pages: 218-223

DOI Bookmark: 10.1109/ECTC.2017.340

Authors

Kaustubh Nagarkar
Xiaoxiao Hou
Nancy Stoffel
Eric Davis
Jeffrey Ashe
David Borton

Abstract

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