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Proceedings
ECTC
ECTC 2017
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
Morphology of Low-Temperature All-Copper Interconnects Formed by Dip Transfer
Year: 2017, Pages: 961-967
DOI Bookmark:
10.1109/ECTC.2017.123
Authors
Luca Del Carro
Jonas Zuercher
Sebastian Gerke
Thomas Wildsmith
Gustavo Ramos
Thomas Brunschwiler
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