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Proceedings
ECTC
ECTC 2017

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Cu/Adhesive Hybrid Bonding at 180 °C in H-Containing HCOOH Vapor Ambient for 2.5D/3D Integration

Year: 2017, Pages: 1243-1248

DOI Bookmark: 10.1109/ECTC.2017.13

Authors

Ran He
Masahisa Fujino
Masatake Akaike
Taiji Sakai
Seiki Sakuyama
Tadatomo Suga

Abstract

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