Join Us
Sign In
My Subscriptions
Magazines
Journals
Video Library
Conference Proceedings
Individual CSDL Subscriptions
Institutional CSDL Subscriptions
Resources

IEEE.org
IEEE CS Standards
Career Center
About Us
Subscribe to Newsletter

0
Sign In

My Subscriptions

Conference Cover Image

Previous
Next
Table of Contents
Similar Articles

Home
Proceedings
ECTC
ECTC 2017

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

High Thermal Performance Package with Anisotropic Thermal Conductive Material

Year: 2017, Pages: 1348-1354

DOI Bookmark: 10.1109/ECTC.2017.115

Authors

Ian Hu
Jia-Rung Ho
Jin-Feng Yang
Meng-Kai Shih
David Tarng
Chih-Pin Hung

Abstract

Sign up for our newsletter

IEEE COMPUTER SOCIETY

About Us
Board of Governors
Newsletters
Press Room
IEEE Support Center
Contact Us

DIGITAL LIBRARY

Magazines
Journals
Conference Proceedings
Video Library

COMPUTING RESOURCES

Jobs Board
Courses & Certifications
Webinars
Podcasts
Tech News
Membership

COMMUNITY RESOURCES

Conference Organizers
Authors
Chapters
Communities

BUSINESS SOLUTIONS

Corporate Partnerships
Conference Sponsorships & Exhibits
Advertising
Recruiting
Digital Library Institution Subscriptions

POLICIES

Privacy
Accessibility Statement
IEEE Nondiscrimination Policy
XML Sitemap

Copyright 2025 IEEE - All rights reserved. A public charity, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.