2009 IEEE International Conference on Computer Design
3D stacked power distribution considering substrate coupling
DOI Bookmark: 10.1109/ICCD.2009.5413151
Authors
Amirali Shayan, University of California, San DiegoXiang Hu, University of California, San Diego
Wanping Zhang, University of California, San Diego
Chung-Kuan Cheng, University of California, San Diego
A. Ege Engin, San Diego State University
Xiaoming Chen, Qualcomm, Inc
Mikhail Popovich, Qualcomm, Inc