2010 IEEE International Test Conference
Characterizing mechanical performance of Board Level Interconnects for In-Circuit Test
DOI Bookmark: 10.1109/TEST.2010.5699252
Authors
Rosa Reinosa, Hewlett-Packard, Palo Alto, CA, USAAileen Allen, Hewlett-Packard, Palo Alto, CA, USA
Elizabeth Benedetto, Hewlett-Packard, Houston, TX, USA
Alan Mcallister, Intel Corporation, Portland, OR, USA