2011 IEEE International Test Conference
Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base
DOI Bookmark: 10.1109/TEST.2011.6139181
Authors
Chun-Chuan Chi, IMEC vzw, Kapeldreef 75, B-3001 Leuven, BelgiumErik Jan Marinissen, IMEC vzw, Kapeldreef 75, B-3001 Leuven, Belgium
Sandeep Kumar Goel, TSMC, 2585 Junction Avenue, San Jose, CA 95134, USA
Cheng-Wen Wu, National Tsing-Hua University, Dept. Electrical Engineering, Hsinchu 30013, Taiwan, ROC