Impact of Quad Flat No Lead package (QFN) on automated X-ray inspection (AXI)

Chwee Liong; Tee; Andy Pascual

doi:10.1109/TEST.2007.4437601

International Test Conference 2007

Impact of Quad Flat No Lead package (QFN) on automated X-ray inspection (AXI)

Year: 2007

DOI Bookmark: 10.1109/TEST.2007.4437601

Authors

Chwee Liong, Test Development Engineering (Malaysia), Intel Kulim, Malaysia
Tee, Test Development Engineering (Malaysia), Intel Kulim, Malaysia
Andy Pascual, Measurement Systems Division, Agilent Technologies Singapore (Sales), Singapore

Abstract

QFN is increasingly being used on wireless cards, handhelds etc. However, QFN unique solder joints pose great challenges for AXI. This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.

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Impact of Quad Flat No Lead package (QFN) on automated X-ray inspection (AXI)

Authors

Abstract

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