Abstract
This paper presents the intricacies of predicting delivery quality of system in package (SiP) devices. The basic production process is explained first. The delivery quality of SiPs is discussed in relation to manufacturing yield and test coverage. The presented tools have been kept as simple as possible in order to make quick and easy application possible. Finally a method for sensitivity analysis is presented that helps to fine tune the balance between yield and test coverage in order to be able to optimize the cost versus benefits.