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Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on

Apr. 30 2003 to Apr. 30 2003

Cannes, France

ISBN: 0-7803-7066-X

Table of Contents

The impact of MEMS and NEMS on biotechnology in the 21st centuryFull-text access may be available. Sign in or learn about subscription options.pp. 1-1
by M. Madou
Papers
Systematic design of microstructures by topology optimizationFull-text access may be available. Sign in or learn about subscription options.pp. 2
by O. Sigmund
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Non destructive evaluation in micro dimensionsFull-text access may be available. Sign in or learn about subscription options.pp. 3
by N. Meyendorf
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Mixed system and component level T-CAD for micro fabricationFull-text access may be available. Sign in or learn about subscription options.pp. 4-9
by U. Hansen, C. Germer, S. Buttgenbach, H.J. Franke
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Electromechanical and electromagnetic analyses of two- and three-plate voltage-controlled oscillators (VCOs) with micromachined tunable capacitorsFull-text access may be available. Sign in or learn about subscription options.pp. 10-14
by D.J. Keating, M. Farina, I. Jafri
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Electro-thermal simulation of MEMS elementsFull-text access may be available. Sign in or learn about subscription options.pp. 15-20
by M. Rencz, V. Szekely, A. Poppe, B. Courtois
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Behavioral modeling and simulation of micromechanical resonator for communications applicationsFull-text access may be available. Sign in or learn about subscription options.pp. 21-26
by C. Mandelbaum, S. Cases, D. Bensaude, L. Basteres, P. Nachtergaele
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Electronic test solutions for FlowFET fluidic arraysFull-text access may be available. Sign in or learn about subscription options.pp. 27-32
by H.G. Kerkhoff, M. Acar
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Development of a 3D-CAD add-in for tolerance analysis and synthesis in micro systems (/spl mu/-ToAST)Full-text access may be available. Sign in or learn about subscription options.pp. 33-38
by C. Germer, U. Hansen, H.-J. Franke, S. Buttgenbach
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Understanding faulty behavior of a peristaltic micropumpFull-text access may be available. Sign in or learn about subscription options.pp. 39-44
by M. Knight, B. Kaminska, J. House
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Design process supporting simulations on wafer level packagesFull-text access may be available. Sign in or learn about subscription options.pp. 45-49
by J.-P. Sommer, O. Wittler, D. Manessis, B. Michel
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On-chip testing of MEMS using pseudo-random test sequencesFull-text access may be available. Sign in or learn about subscription options.pp. 50-55
by L. Rufer, S. Mir, E. Simeu, C. Domingues
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VHDL-AMS modelling, simulation and testing of electrostatic micromotorsFull-text access may be available. Sign in or learn about subscription options.pp. 56-63
by A. Endemano, J.Y. Fourniols, H. Camon, A. Marchese, S. Muratet, F. Bony, M.P.Y. Desmulliez
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A compact MCM implementation of an embedded system for automotive applicationsFull-text access may be available. Sign in or learn about subscription options.pp. 64-68
by J.L. Merino, S.A. Bota, J. Samitier, B. Niessen, E. Cabruja, J. Bausells, A. Ferre
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A mixed-mode interface circuit for gas sensor control and measureFull-text access may be available. Sign in or learn about subscription options.pp. 69-74
by J.L. Merino, R. Casanova, A. Dieguez, S.A. Bota, J. Samitier, C. Cane
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A study of electronic interface for MEMS Variable Optical Attenuator (VOA)Full-text access may be available. Sign in or learn about subscription options.pp. 75-78
by H. Cai, C.W. Chan, C.S. Thian, X.M. Zhang, C. Lu, A.Q. Liu
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Parameter identification and macromodeling of hysteresis phenomenaFull-text access may be available. Sign in or learn about subscription options.pp. 79-83
by D. Peters, S. Rehfuss, R. Laur, H.-G. Brachtendorf
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Construction kit for microoptical systems on the basis of microoptical benchesFull-text access may be available. Sign in or learn about subscription options.pp. 84-89
by I. Sieber, U. Gengenbach, A. Hofmann
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Calculation of partial capacitances using a modified iterative complex image methodFull-text access may be available. Sign in or learn about subscription options.pp. 90-94
by S. Rehfuss, C. Gorecki, D. Peters, R. Laur
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A CMOS low noise amplifier for biomedical telemetry applicationsFull-text access may be available. Sign in or learn about subscription options.pp. 95-98
by R.L. Moreno, E.C. Rodrigues
An approach of lateral RF MEMS switch for high performanceFull-text access may be available. Sign in or learn about subscription options.pp. 99-102
by M. Tang, A. Agarwal, J. Li, Q.X. Zhang, P. Win, J.M. Huang, A.Q. Liu
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Parallel-beams/lever electrothermal out-of-plane actuatorFull-text access may be available. Sign in or learn about subscription options.pp. 103-107
by S. Deladi, G. Krijnen, M.C. Elwenspoek
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Study and realisation of a micromechanical relay for use in a harsh environmentFull-text access may be available. Sign in or learn about subscription options.pp. 108-112
by F. Conseil, P. Derderian, M.-F. Ravat, D. Collard, L. Buchaillot
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Integrated multistage MEMS-based optical switchFull-text access may be available. Sign in or learn about subscription options.pp. 113-116
by Geng-Sheng Kuo, Yong Yin
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Three-dimensional MEMS simulation using Euler parametersFull-text access may be available. Sign in or learn about subscription options.pp. 117-120
by G. Casinovi
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A new computational method for piezoelectric plate modeling: application to membrane microsensorsFull-text access may be available. Sign in or learn about subscription options.pp. 121-126
by L. Ferrario, S. Taschini, M. Emmenegger, H. Baltes, J.G. Korvink
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Design and simulation of MEMS optical crossconnect with integrated nanophotonic crystals technologyFull-text access may be available. Sign in or learn about subscription options.pp. 127-130
by H.G. Teo, J. Singh, C. Lu, A.Q. Liu
Papers
Construction of nonlinear dynamic MEMS component models using Cosserat theoryFull-text access may be available. Sign in or learn about subscription options.pp. 131-136
by C. Wang, D. Liu, R. Rosing, B. De Masi, A. Richardson
Papers
A generalized computational formulation and model for transport and stoichiometry of multivalent weak analytes in Capillary Electrophoresis techniquesFull-text access may be available. Sign in or learn about subscription options.pp. 137-142
by A. Chatterjee, D. Keating
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Theoretical aspects concerning the calculus possibilities of magnetic fluid core coilsFull-text access may be available. Sign in or learn about subscription options.pp. 143-148
by N.C. Popa, A. Siblini, L. Jorat
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Application of the "Multi Architecture Modeling" design method to system level MEMS simulationFull-text access may be available. Sign in or learn about subscription options.pp. 149-153
by M. Schlegel, G. Herrmann, D. Muller
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Design and modelling of a microsensor for atmospheric electric field measurementFull-text access may be available. Sign in or learn about subscription options.pp. 154-158
by Zheng Cui, Chao Gong, Shanhong Xia
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Computer aided design of a radiometric system for material sheet productionFull-text access may be available. Sign in or learn about subscription options.pp. 159-163
by H. Bolte, O. Nussen, D. Peters, R. Laur, D. Richter
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Neural network approach for linearization of the electrostatically actuated double-gimballed micromirrorFull-text access may be available. Sign in or learn about subscription options.pp. 164-169
by Guangya Zhou, K.K.L. Cheo, F.E.H. Tay, F.E.H. Tay
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A new methodology for modeling MEMS StructuresFull-text access may be available. Sign in or learn about subscription options.pp. 170-175
by Kaiping Zeng, Zhenyu Liu, J.G. Korvink
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The hierarchical HDL-based design of an integrated MEMS-CMOS oscillatorFull-text access may be available. Sign in or learn about subscription options.pp. 176-180
by R. Gaddi
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Dynamics modeling of microbeams under electrostatic loadFull-text access may be available. Sign in or learn about subscription options.pp. 181-186
by E. Brusa, F. De Bona, A. Gugliotta, A. Soma
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Design and characterisation of a low-power micromachined spatial light modulatorFull-text access may be available. Sign in or learn about subscription options.pp. 187-191
by G. McRobbie, Zaikang Ling, F. Clark
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Process stress estimation for MEMS RF switches with mixed analytical and numerical simulationFull-text access may be available. Sign in or learn about subscription options.pp. 192-196
by L. Ferrario, C. Armaroli, B. Margesin, G. Soncini
Papers
Model-based optimization of Medical Test StripsFull-text access may be available. Sign in or learn about subscription options.pp. 197-200
by O. Nussen, D. Peters, H. Bolte, R. Laur
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3D silicon turning micromirrorFull-text access may be available. Sign in or learn about subscription options.pp. 201-203
by Chen Shi-Hao, Chien Chao-Heng
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Evaluation of principal characteristics of circular resonator in thin film applicationsFull-text access may be available. Sign in or learn about subscription options.pp. 204-207
by S. Myllymaki, E. Ristolainen, P. Heino, A. Lehto, K. Varjonen
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Thermal and mechanical simulation of bulk resonatorsFull-text access may be available. Sign in or learn about subscription options.pp. 208-213
by M. Morata, E. Figueras, I. Gracia, L. Fonseca, C. Cane
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Analysis, and optimization of a CMOS vertical thermal actuatorFull-text access may be available. Sign in or learn about subscription options.pp. 214-217
by A. Mohamed, H. Elsimary, M. Ismail
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Design, Test, Integration and Packaging of MEMS/MOEMS 2003 (IEEE Cat. No.03EX713)Full-text access may be available. Sign in or learn about subscription options.pp. 214-217
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Numerical simulation of hydrogel-based pH-responsive biosensors in BioMEMSFull-text access may be available. Sign in or learn about subscription options.pp. 218-222
by Hua Li, Y.K. Yew, K.Y. Lam, T.Y. Ng
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Capacitive humidity sensor using a polyimide sensing filmFull-text access may be available. Sign in or learn about subscription options.pp. 223-228
by J. Laconte, V. Wilmart, J.-P. Raskin, D. Flandre
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"Plug-up"-a new concept for fabricating SOI MEMS devicesFull-text access may be available. Sign in or learn about subscription options.pp. 229-233
by J. Kiihamaki, P. Pekko, H. Kattelus, T. Sillanpaa, T. Mattila
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A novel drie fabrication process development for SOI-based MEMS devicesFull-text access may be available. Sign in or learn about subscription options.pp. 234-238
by J. Li, Q.X. Zhang, A.Q. Liu
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Wafer-scale 0-level packaging of (RF-)MEMS devices using BCBFull-text access may be available. Sign in or learn about subscription options.pp. 239-244
by A. Jourdain, H. Ziad, P. De Moor, H.A.C. Tilmans
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Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow processFull-text access may be available. Sign in or learn about subscription options.pp. 245-250
by C. Rusu, H. Jansen, R. Gunn, A. Witvrouw
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Testing of a LIGA-microspectrometer for monitoring dissolved nickel concentration when etching nickel and its alloys in aqueous ferric chloride solutionsFull-text access may be available. Sign in or learn about subscription options.pp. 251-254
by D.M. Allen, H.J.A. Almond, D. Boubal
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Soldered sealing process to assemble a protective cap for a MEMS CSPFull-text access may be available. Sign in or learn about subscription options.pp. 255-260
by Erik Jung, A. Ostmann, M. Wiemer, I. Kolesnik, M. Hutter
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Dielectric miceocavity resonators based on silicon moldFull-text access may be available. Sign in or learn about subscription options.pp. 261-264
by Yigui Li, Di Chen, Jun Zhu, Jingquan Liu, Jiliang Zhang
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Bonding of polymer microstructures by UV irradiation and welding at low temperaturesFull-text access may be available. Sign in or learn about subscription options.pp. 265-267
by R. Truckenmuller, P. Henzi, D. Herrmann, V. Saile, W.K. Schomburg
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SU8 resist plasma etching and its optimisationFull-text access may be available. Sign in or learn about subscription options.pp. 268-271
by Guodong Hong, A.S. Holmes, M.E. Heaton
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New aspects of simulation in hot-embossingFull-text access may be available. Sign in or learn about subscription options.pp. 272-274
by M. Worgull, M. Heckele
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A new electroforming technology in aid of pressure for LIGA processFull-text access may be available. Sign in or learn about subscription options.pp. 275-280
by Hsiharng Yang, Tsung-Shuin Tsai, Reiyu Chein, Chia-Hua Chang, Jen-Chin Wu
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On-wafer electro-mechanical characterization of silicon MEMS switchesFull-text access may be available. Sign in or learn about subscription options.pp. 281-285
by L. Lorenzelli, K.J. Rangra, C. Collini, F. Giacomozzi, B. Margesin, F. Pianegiani
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A novel self-sensitive SFM for nondestructive measurement of tiny vertical surfaces with restricted accessFull-text access may be available. Sign in or learn about subscription options.pp. 286-289
by T. Kobayashi, X.C. Shan, Y. Murakoshi, R. Maeda
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Design and fabrication of a peristaltic micropumpFull-text access may be available. Sign in or learn about subscription options.pp. 290-294
by M. Knight, J. House
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Production metrology for MEMS characterizationFull-text access may be available. Sign in or learn about subscription options.pp. 295-299
by E. Novak, F. Pasop, T. Browne
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Thin film formation-a fabrication on non-planar surface by spray coating methodFull-text access may be available. Sign in or learn about subscription options.pp. 300-303
by M. Ichiki, Lulu Zhang, Zhen Yang, T. Ikehara, R. Maeda
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Hot embossing characteristics of PEEK compared to PC and PMMAFull-text access may be available. Sign in or learn about subscription options.pp. 304-311
by Y. Murakoshi, Y. Murakoshi, T. Shimizu, R. Maeda
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Quantitative study of the 'M.E.M.S.N.A.S.' process for 3D microfabrication using binary lithographyFull-text access may be available. Sign in or learn about subscription options.pp. 312-317
by F. Marty, S. Didelon, B. Mercier, C. Moyroud, T. Bourouina
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Ion track lithography: novel low-cost process to form deep vertical and high aspect ratio MEMS in flexible laminatesFull-text access may be available. Sign in or learn about subscription options.pp. 318-323
by H. Majjad, M. Lindeberg, M. Skupinski, K. Hjort
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Ensuring reliability and repeatability in LIGA mold insert fabricationFull-text access may be available. Sign in or learn about subscription options.pp. 324-328
by J. Schulz, K. Bade, M. Guttmann, L. Hahn, A. Janssen, U. Kohler, P. Meyer, F. Winkler
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Fracture behaviour of single crystal silicon microstructuresFull-text access may be available. Sign in or learn about subscription options.pp. 329-334
by F.F. Meroni, E. Mazza
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Modular parametric finite element modelling for reliability-studies in electronic and MEMS packagingFull-text access may be available. Sign in or learn about subscription options.pp. 335-340
by B. Wunderle, J. Auersperg, V. Grosser, E. Kaulfersch, O. Wittler, B. Michel
Authors indexFreely available from IEEE.pp. 412-413
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Mechanical qualification of RF-filters for space applicationsFull-text access may be available. Sign in or learn about subscription options.pp. 341-345
by X. Lafontan, J. Kuchenbecker, B. Guillon, P. Pons, P. Nerin, F. Pressecq, M. Dardalhon, S. Rigo
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Getters films at wafer level for wafer to wafer bonded MEMSFull-text access may be available. Sign in or learn about subscription options.pp. 346-349
by M. Moraja, M. Amiotti
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Fabrication sub-micron gratings based on embossingFull-text access may be available. Sign in or learn about subscription options.pp. 350-352
by Yigui Li, Chun Hui, Jun Zhu, Jingquan Liu, Y. Kanamori
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Microfabrication of electroplated integrated chromium tips onto a silicon actuatorFull-text access may be available. Sign in or learn about subscription options.pp. 353-355
by E. Lennon, F. Ayela
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Hexagonal microlens array fabricated by proximity printing via UV lithographyFull-text access may be available. Sign in or learn about subscription options.pp. 356-361
by Hsiharng Yang, Che-Ping Lin, Ching-Kong Chao, Cheng-Tang Pan
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Fabrication comb-drive device by MEMS and electroplatingFull-text access may be available. Sign in or learn about subscription options.pp. 362-366
by Chien Chao-Heng, Chen Shi-Hao
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A novel method for determining Young's modulus of thin films by micro-strain gaugesFull-text access may be available. Sign in or learn about subscription options.pp. 367-372
by Chen Shi-Hao
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SU-8 process for biomedical inspection /spl mu/-carriersFull-text access may be available. Sign in or learn about subscription options.pp. 373-377
by P.-H. Chen, P.-P. Ding, J.-S. Kuo
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P/sup +/ silicon recessed micromechanical structures for MEMS applicationsFull-text access may be available. Sign in or learn about subscription options.pp. 378-381
by P. Pal, S. Tuli, S. Chandra
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A novel electrically controlled flexible liquid micro lensFull-text access may be available. Sign in or learn about subscription options.pp. 382-386
by M. Feldmann, S. Butefisch, S. Buttgenbach
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Analysis of failure modes and mechanisms in thermally actuated micromachined relays for harsh environments space applicationsFull-text access may be available. Sign in or learn about subscription options.pp. 387-393
by A. Teverovsky, Ashok Sharma
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Yield strength of thin-film parylene-cFull-text access may be available. Sign in or learn about subscription options.pp. 394-398
by Ashok Sharma, T.A. Harder, Yu-Chong Tai
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Manufacturing of micro electrodes using ultra sonic aided electrochemical machiningFull-text access may be available. Sign in or learn about subscription options.pp. 399-401
by Feng-Tsai Wang, Chen-Siang Hsu, R.F. Shyu, C.T. Ho
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Stress characterization of electroplated gold layers for low temperature surface micromachiningFull-text access may be available. Sign in or learn about subscription options.pp. 402-405
by B. Margesin, A. Bagolini, V. Guarnieri, F. Giacomozzi, A. Faes, R. Pal, M. Decarli
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Feasibility of a flip chip approach to integrate an IR filter and an IR detector in a future gas detection cellFull-text access may be available. Sign in or learn about subscription options.pp. 407-410
by L. Fonseca, E. Cabruja, C. Calaza, R. Rubio, J. Santander, E. Figueras, I. Gracia, C. Cane, M. Moreno, S. Marco
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