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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

May 30 2017 to June 2 2017

Orlando, FL

Table of Contents

[Title page i]Freely available from IEEE.pp. i-i
[Title page iii]Freely available from IEEE.pp. iii-iii
[Copyright notice]Freely available from IEEE.pp. iv-iv
Table of contentsFreely available from IEEE.pp. v-xxxiii
Welcome from the 67th ECTC General and Program ChairsFreely available from IEEE.pp. xxxiv-xxxv
Executive CommitteeFreely available from IEEE.pp. xxxvi-xxxviii
Program CommitteeFreely available from IEEE.pp. xxxix-lv
Development of a Multi-project Fan-Out Wafer Level Packaging PlatformFull-text access may be available. Sign in or learn about subscription options.pp. 1-7
by T. Braun, S. Raatz, U. Maass, M. van Dijk, H. Walter, O. Hölck, K.-F. Becker, M. Töpper, R. Aschenbrenner, M. Wöhrmann, S. Voges, M. Huhn, K.-D. Lang, M. Wietstruck, R. F. Scholz, A. Mai, M. Kaynak
SLIM (TM), High Density Wafer Level Fan-Out Package Development with Submicron RDLFull-text access may be available. Sign in or learn about subscription options.pp. 8-13
by YoungRae Kim, JaeHun Bae, MinHwa Chang, AhRa Jo, Ji Hyun Kim, SangEun Park, David Hiner, Michael Kelly, WonChul Do
Development of Novel High Density System Integration Solutions in FOWLP-Complex and Thin Wafer-Level SiP and Wafer-Level 3D PackagesFull-text access may be available. Sign in or learn about subscription options.pp. 14-21
by André Cardoso, Leonor Dias, Elisabete Fernandes, Alberto Martins, Abel Janeiro, Paulo Cardoso, Hugo Barros
Fan-Out Chip on Substrate Device Interconnection Reliability AnalysisFull-text access may be available. Sign in or learn about subscription options.pp. 22-27
by Ying-Chih Lee, Wei-Hong Lai, Ian Hu, Meng-Kai Shih, Chin-Li Kao, David Tarng, Ching-Pin Hung
Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology without Molding and De-Bonding ProcessesFull-text access may be available. Sign in or learn about subscription options.pp. 28-34
by Daquan Yu, Zhenrui Huang, Zhiyi Xiao, Li Yang, Min Xiang
Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLPFull-text access may be available. Sign in or learn about subscription options.pp. 35-40
by Wen-Wei Shen, Yu-Min Lin, Hsiang-Hung Chang, Tzu-Ying Kuo, Huan-Chun Fu, Yuan-Chang Lee, Shu-Man Lee, Ang-Ying Lin, Shin-Yi Huang, Tao-Chih Chang, Alvin Lee, Jay Su, Baron Huang, Dongshun Bai, Xiao Liu, Kuan-Neng Chen
First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip IntegrationFull-text access may be available. Sign in or learn about subscription options.pp. 41-46
by Tailong Shi, Chintan Buch, Vanessa Smet, Yoichiro Sato, Lutz Parthier, Frank Wei, Cody Lee, Venky Sundaram, Rao Tummala
A Cost Effective Via Last TSV Technology Using Molten Solder Filling for Automobile ApplicationFull-text access may be available. Sign in or learn about subscription options.pp. 47-52
by Yuki Ohara, Yuki Inagaki, Masaki Matsui, Kazushi Asami
Accurate Depth Control of Through-Silicon Vias by Substrate Integrated Etch Stop LayersFull-text access may be available. Sign in or learn about subscription options.pp. 53-60
by M. Wietstruck, S. Marschmeyer, M. Lisker, A. Krueger, D. Wolansky, P. Kulse, A. Goeritz, M. Inac, T. Voss, A. Mai, M. Kaynak
Application of a Metallic Cap Layer to Control Cu TSV ExtrusionFull-text access may be available. Sign in or learn about subscription options.pp. 61-66
by Golareh Jalilvand, Omar Ahmed, Keenan Bosworth, Cullen Fitzgerald, Zhenlin Pei, Tengfei Jaing
Development of TSV Electroplating Process for Via-Last TechnologyFull-text access may be available. Sign in or learn about subscription options.pp. 67-72
by Gilho Hwang, Ravanethran Kalaiselvan
Reliability Evaluation of Copper (Cu) Through-Silicon Vias (TSV) Barrier and Dielectric Liner by Electrical Characterization and Physical Failure Analysis (PFA)Full-text access may be available. Sign in or learn about subscription options.pp. 73-79
by Jiawei Marvin Chan, Xu Cheng, Kheng Chooi Lee, Werner Kanert, Chuan Seng Tan
Vertical Delay Modeling of Copper/Carbon Nanotube Composites in a Tapered through Silicon ViaFull-text access may be available. Sign in or learn about subscription options.pp. 80-85
by Madhav Rao
Latency, Bandwidth and Power Benefits of the SuperCHIPS Integration SchemeFull-text access may be available. Sign in or learn about subscription options.pp. 86-94
by SivaChandra Jangam, Saptadeep Pal, Adeel Bajwa, Sudhakar Pamarti, Puneet Gupta, Subramanian S. Iyer
Key Properties for Successful Ultra Thin Die PickupFull-text access may be available. Sign in or learn about subscription options.pp. 95-101
by Stefan Behler, Wang Teng, Arnita Podpod
Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip PackageFull-text access may be available. Sign in or learn about subscription options.pp. 102-107
by Nokibul Islam, Vinayak Pandey, KyungOe Kim
Improvement of C2W Collective Bonding Reliability and UPH through Innovations in Machine, Materials and MethodsFull-text access may be available. Sign in or learn about subscription options.pp. 108-115
by Tomonori Nakamura, Farhan Shafiq, Tetsuya Otani, Osamu Watanabe, Toru Maeda, Yoshihito Hagiwara, Keiji Honjo, Tamotsu Owada, Daichi Mori, Outa Egashira, Tatsuo Nagamatsu
Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die StacksFull-text access may be available. Sign in or learn about subscription options.pp. 116-122
by Pascale Gagnon, Christian Bergeron, Richard Langlois, Stéphane Barbeau, Steve Whitehead, Christy Tyberg, Ray Robertazzi, Katsuyuki Sakuma, Matthew Wordeman, Michael Scheurmann
Chip Shooter to Enable Fine Pitch Flip ChipFull-text access may be available. Sign in or learn about subscription options.pp. 123-129
by Jie Fu, Manuel Aldrete, Milind Shah
Assembly Challenges for 75x75mm Large Body FCBGA with Emerging High Thermal Interface Material (TIM)Full-text access may be available. Sign in or learn about subscription options.pp. 130-135
by Fletcher Tung, Max Lu, Albert Lan, Steward Pan
Fine Pitch Interconnect Rework for Lead-Free Flip Chip PackagesFull-text access may be available. Sign in or learn about subscription options.pp. 136-143
by M. Kanso, D. Danovitch, E. Nguena, R. Langlois, C. Bergeron
A Novel Organic Substrate with Enhanced Thermal ConductivityFull-text access may be available. Sign in or learn about subscription options.pp. 144-149
by Xiaoliang Zeng, Yimin Yao, Yougen Hu, Kun Guo, Jiajia Sun, Rong Sun, Jian-Bin Xu, Ching-Ping Wong
Infusing Inorganics into the Subsurface of Polymer Redistribution Layer Dielectrics for Improved Adhesion to Metals InterconnectsFull-text access may be available. Sign in or learn about subscription options.pp. 150-155
by Shreya Dwarakanath, Pulugurtha Markondeya Raj, Collen Z. Leng, Vanessa Smet, Mark D. Losego, Venky Sundaram, Rao Tummala
Development of Solder Resist with Improved Adhesion at HTSL (175 deg C for 3000 Hours) and Crack Resistance at TST for Automotive IC PackageFull-text access may be available. Sign in or learn about subscription options.pp. 156-165
by Chiho Ueta, Kazuya Okada, Toko Shiina, Tadahiko Hanada, Nobuhito Ito
Bondable Copper Substrates with Silver Solid Solution Coatings for High-Power Electronic ApplicationsFull-text access may be available. Sign in or learn about subscription options.pp. 166-172
by Yongjun Huo, Chin C. Lee
On-Chip Integrated Solid-State Micro-SupercapacitorFull-text access may be available. Sign in or learn about subscription options.pp. 173-178
by A. M. Saleem, R. Andersson, V. Desmaris, B. Song, C. P. Wong
Development of CPU Package Embedded with Multilayer Thin Film Capacitor for Stabilization of Power SupplyFull-text access may be available. Sign in or learn about subscription options.pp. 179-184
by Tomoyuki Akahoshi, Daisuke Mizutani, Kei Fukui, Seigo Yamawaki, Hidehiko Fujisaki, Manabu Watanabe, Masateru Koide
Panel-Based Integrated Passive Device for RF ApplicatioFull-text access may be available. Sign in or learn about subscription options.pp. 185-189
by Ming-Hung Chen, Tzu-Hsing Chiang, Jia-Hao Zhang, Hsu-Chiang Shih, Sheng-Chi Hsieh, Teck Chong Lee, Chih-Pin Hung
Phototriggerable, Fully Transient Electronics: Component and Device FabricationFull-text access may be available. Sign in or learn about subscription options.pp. 190-196
by Gerald Gourdin, Oluwadamilola Phillips, Jared Schwartz, Anthony Engler, Paul Kohl
Novel High Temperature Capacitive Pressure Sensor Utilizing SiC Integrated Circuit Twin Ring OscillatorsFull-text access may be available. Sign in or learn about subscription options.pp. 197-205
by Maximilian C. Scardelletti, Philip G. Neudeck, David J. Spry, Roger D. Meredith, Jennifer L. Jordan, Norman F. Prokop, Michael J. Krasowski, Glenn M. Beheim, Gary W. Hunter
An Experimental Magnesium Ion Battery Cell Made of Flexible MaterialsFull-text access may be available. Sign in or learn about subscription options.pp. 206-211
by Todd Houghton, Gamal Eltohamy, Hongbin Yu
Fractal-Structured, Wearable Soft Sensors for Control of a Robotic Wheelchair via ElectrooculogramsFull-text access may be available. Sign in or learn about subscription options.pp. 212-217
by Saswat Mishra, Yongkuk Lee, Dong Sup Lee, Woon-Hong Yeo
Micro-Hermetic Packaging Technology for Active Implantable Neural InterfacesFull-text access may be available. Sign in or learn about subscription options.pp. 218-223
by Kaustubh Nagarkar, Xiaoxiao Hou, Nancy Stoffel, Eric Davis, Jeffrey Ashe, David Borton
Biopackaging of Minimally Invasive Ultrasound Assisted Clot Lysis Device for Stroke TreatmentFull-text access may be available. Sign in or learn about subscription options.pp. 224-229
by Ramona Damalerio, Ming-Yuan Cheng, Weiguo Chen, Liang Lou, Songsong Zhang
A Low-Profile Flow Sensing System for Monitoring of Cerebrospinal Fluid with a New Ventriculoamniotic ShuntFull-text access may be available. Sign in or learn about subscription options.pp. 230-235
by Yanfei Chen, Connor Howe, Stephen Emery, Stephanie Greene, Puneeth Shridhar, Woon-Hong Yeo, Youngjae Chun
First Demonstration of 28 GHz and 39 GHz Transmission Lines and Antennas on Glass Substrates for 5G ModulesFull-text access may be available. Sign in or learn about subscription options.pp. 236-241
by Atom O. Watanabe, Muhammad Ali, Bijan Tehrani, Jimmy Hester, Hiroyuki Matsuura, Tomonori Ogawa, P. Markondeya Raj, Venky Sundaram, Manos M. Tentzeris, Rao R. Tummala
Integrated Antenna-in-Package on Low-Cost Organic Substrate for Millimeter-Wave Wireless Communication ApplicationsFull-text access may be available. Sign in or learn about subscription options.pp. 242-247
by Cheng-Yu Ho, Ming-Fong Jhong, Po-Chih Pan, Chih-Yi Huang, Chen-Chao Wang, Chun-Yen Ting
Aerosol-Jet Printed Quasi-Optical Terahertz FiltersFull-text access may be available. Sign in or learn about subscription options.pp. 248-253
by Christopher Oakley, Amanpreet Kaur, Jennifer A. Byford, Premjeet Chahal
High Performance Chip-Partitioned Millimeter Wave Passive Devices on Smooth and Fine Pitch InFO RDLFull-text access may be available. Sign in or learn about subscription options.pp. 254-259
by Che-Wei Hsu, Chung-Hao Tsai, Jeng-Shien Hsieh, Kuo-Chung Yee, Chuei-Tang Wang, Douglas Yu
Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and PackagingFull-text access may be available. Sign in or learn about subscription options.pp. 260-265
by Seahee Hwangbo, Sheng-Po Fang, Hyowon An, Yong-Kyu Yoon, Aric B. Shorey, Abbas M. Kazmi
RF Characterization and Modeling of 10 µm Fine-Pitch Cu-Pillar on a High Density Silicon InterposerFull-text access may be available. Sign in or learn about subscription options.pp. 266-272
by H. Jacquinot, L. Arnaud, A. Garnier, F. Bana, J. C. Barbe, S. Cheramy
Miniature 2.4-GHz Switched Beamformer Module in IPD and Its Application to Very-Low-Profile 1D and 2D Scanning Antenna ArraysFull-text access may be available. Sign in or learn about subscription options.pp. 273-284
by Chia-Hao Chen, Wei-Ting Fang, Yo-Shen Lin
Development of Liquid, Granule and Sheet Type Epoxy Molding Compounds for Fan Out Wafer Level PackageFull-text access may be available. Sign in or learn about subscription options.pp. 285-291
by Kenichi Ueno, Kazuhiro Dohi, Kazuyoshi Muranaka, Yuki Ishikawa, Akira Nakao
Ultra-Low Temperature FOWLP Process for the Embedding of Low Thermal Budget Sensors and Components Using SU-8 as DielectricFull-text access may be available. Sign in or learn about subscription options.pp. 292-299
by R. Pinto, A. Cardoso, S. Ribeiro, C. Brandão, F. Cardoso, M. Antunes, J. Gaspar, R. Gill, H. Fonseca, M. Costa
Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICsFull-text access may be available. Sign in or learn about subscription options.pp. 300-305
by Venky Sundaram, Bartlet Deprospo, Nahid Gezgin, Atomu Watanabe, P. Markondeya Raj, Fuhan Liu, Waylon Puckett, Samuel Graham, Rao Tummala, Kyle Byers, Sean Garrison
Implementation of Thick Copper Inductor Integrated into Chip Scaled PackageFull-text access may be available. Sign in or learn about subscription options.pp. 306-311
by S. B. Yang, C. C. Chen, W. L. Huang, T. L. Yang, G. C. Huang, T. Y. Chou, C. C. Hsu, C. L. Chang, H. L. Huang, C. C. Chou, C. Y. Ku, C. H. Chen, C. S. Chen, K. C. Liu, Alex Kalnitsky, Marvin Liao
Passive Devices Fabrication on FOWLP and Characterization for RF ApplicationsFull-text access may be available. Sign in or learn about subscription options.pp. 312-318
by Chunmei Wang, King Jien Chui, Xiangyu Wang, Teck Guan Lim, Mingbin Yu, Gilbert See, Gu Yu
Compression Molding Encapsulants for Wafer-Level Embedded Active Devices: Wafer Warpage Control by Epoxy Molding CompoundsFull-text access may be available. Sign in or learn about subscription options.pp. 319-323
by Kihyeok Kwon, Yoonman Lee, Junghwa Kim, Joo Young Chung, Kyunghag Jung, Yong-Yeop Park, Donghwan Lee, Sang Kyun Kim
Additive Manufacturing of Magnetic Components for Heterogeneous IntegrationFull-text access may be available. Sign in or learn about subscription options.pp. 324-330
by Yi Yan, Lanbing Liu, Chao Ding, Luu Nguyen, Jim Moss, Yunhui Mei, Guo-Quan Lu
Expanding Film and Process for High Efficiency 5 Sides Protection and FO-WLP FabricationFull-text access may be available. Sign in or learn about subscription options.pp. 331-336
by Kazutaka Honda, Naoya Suzuki, Toshihisa Nonaka, Hirokazu Noma, Yoshinobu Ozaki
Laser Multi Beam Full Cut Dicing of Wafer Level Chip-Scale PackagesFull-text access may be available. Sign in or learn about subscription options.pp. 337-342
by Jeroen van Borkulo, Eric M. M. Tan, Richard van der Stam
Plasma Dicing 300mm Framed Wafers — Analysis of Improvement in Die Strength and Cost Benefits for Thin Die SingulationFull-text access may be available. Sign in or learn about subscription options.pp. 343-349
by Richard Barnett
Plasma Dicing Fully Integrated Process-Flows Suitable for BEOL Advanced Packaging FabricationsFull-text access may be available. Sign in or learn about subscription options.pp. 350-357
by Frank Wei, Tomotaka Tabuchi, Thierry Lazerand, Christopher Johnston, Kenneth Mackenzie, Marco Notarianni
Stealth Dicing Challenges for MEMS Wafer ApplicationsFull-text access may be available. Sign in or learn about subscription options.pp. 358-363
by Daniel Ismael Cereno, Sunil Wickramanayaka
A Novel Pick-Up and Place Process for FO-WLP Using Tape Expansion Machine DeviceFull-text access may be available. Sign in or learn about subscription options.pp. 364-370
by Naoya Okamoto, Tadatomo Yamada, Toshiaki Menjo, Masatomo Nakamura
Investigation of Production Quality and Reliability Risk of ELK Wafer WLCSP PackageFull-text access may be available. Sign in or learn about subscription options.pp. 371-375
by P. H. Tsao, T. M. Chen, Y. L. Kuo, C. M. Kuo, Steven Hsu, M. J. Lii, L. H. Chu
Cu-SnAg Interconnects Evaluation for the Assembly at 10µm and 5µm PitchFull-text access may be available. Sign in or learn about subscription options.pp. 376-383
by Divya Taneja, Marion Volpert, Gilles Lasfargues, Bertrand Chambion, Boris Bouillard, Sylvie Jarjayes, Tarik Chaira, Aureili Vandeneynde, Yannick Goiran, David Henry, Fiqiri Hodaj
Scaling Cu Pillars to 20um Pitch and Below: Critical Role of Surface Finish and Barrier LayersFull-text access may be available. Sign in or learn about subscription options.pp. 384-391
by Ting-Chia Huang, Vanessa Smet, P. M. Raj, Rick Nichols, Gustavo Ramos, Maja Tomic, Robin Taylor, Rao Tummala
Thermal Compression Bonding: Understanding Heat Transfer by in Situ Measurements and ModelingFull-text access may be available. Sign in or learn about subscription options.pp. 392-398
by Pieter Bex, Teng Wang, Melina Lofrano, Vladimir Cherman, Giovanni Capuz, Erik Sleeckx, Eric Beyne
A Study on Nano-Sized Silica Contents and Size Effect in Non-conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump InterconnectionFull-text access may be available. Sign in or learn about subscription options.pp. 399-404
by Hanmin Lee, Seyong Lee, Semin Cho, Younghyun Yu, Jongho Park, Kyoung-Wook Paik
Accelerated SLID Bonding for Fine-Pitch Interconnects with Porous MicrostructureFull-text access may be available. Sign in or learn about subscription options.pp. 405-410
by Jörg Meyer, Iuliana Panchenko, Laura Wambera, Steffen Bickel, Wieland Wahrmund, M. Juergen Wolf
Low Temperature Ni/Sn/Ni Transient Liquid Phase Bonding for High Temperature Packaging Applications by Imposing Temperature GradientFull-text access may be available. Sign in or learn about subscription options.pp. 411-416
by Y. Zhong, N. Zhao, H. T. Ma, W. Dong, M. L. Huang, C. P. Wong
Interfacial Reaction and Microstructural Evolution between Au-Ge Solder and Electroless Ni-W-P Metallization in High Temperature Electronics InterconnectsFull-text access may be available. Sign in or learn about subscription options.pp. 417-422
by Li Liu, Jinzi Cui, Jing Wang, Zhaoxia Zhou, R. Wayne Johnson, Changqing Liu
Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder JointsFull-text access may be available. Sign in or learn about subscription options.pp. 423-428
by Mohammed Genanu, Francis Mutuku, Eric J Cotts, James Wilcox, Babak Arfaei, Eric Perfecto
Visualization of Microstructural Evolution in Lead Free Solders during Isothermal Aging Using Time-Lapse ImageryFull-text access may be available. Sign in or learn about subscription options.pp. 429-440
by Nianjun Fu, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Failure Mechanism and Kinetics Studies of Electroless Ni-P Dissolution in Pb-Free Solder Joints under ElectromigrationFull-text access may be available. Sign in or learn about subscription options.pp. 441-447
by Pilin Liu, Chaitra Chavali, Alan Overson, Deepak Goyal
Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending TestFull-text access may be available. Sign in or learn about subscription options.pp. 448-455
by Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee
Road Test and Reliability Analysis of Automotive Electronic ModulesFull-text access may be available. Sign in or learn about subscription options.pp. 456-463
by Dongji Xie, Joe Hai, Zhongming Wu, Jack Huang, Manthos Economou
Effects of the Inter-Metallic Compounds Microstructure on Electro-Migration of Sn-Bi Solder SystemFull-text access may be available. Sign in or learn about subscription options.pp. 464-469
by Kei Murayama, Mitsuhiro Aizawa, Takashi Kurihara
Effect of PCB and Package Type on Board Level Vibration Using Vibrational Spectrum AnalysisFull-text access may be available. Sign in or learn about subscription options.pp. 470-475
by J. Jalink, R. Roucou, J. J. M. Zaal, J. Lesventes, R. T. H. Rongen
Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control UnitFull-text access may be available. Sign in or learn about subscription options.pp. 476-482
by Bulong Wu, Dae-Suk Kim, Bongtae Han, Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Jakub Gromala
Semiconductor Power Package Bonding Interconnects Reliability Simulation under Transient Thermal LoadsFull-text access may be available. Sign in or learn about subscription options.pp. 483-490
by Richard Qian, Roger Stout, Yong Liu
Correlation of Dielectric Film Flex Fatigue Resistance and Package Resin Cracking FailureFull-text access may be available. Sign in or learn about subscription options.pp. 491-496
by Shidong Li, Joseph R. Ross, Steven P. Ostrander, Kamal K. Sikka, Nicolas E. Pizzuti
Development of FE Models and Measurement of Internal Deformations of Fuze Electronics Using X-Ray MicroCT Data with Digital Volume CorrelationFull-text access may be available. Sign in or learn about subscription options.pp. 497-506
by Pradeep Lall, Nakul Kothari, John Deep, Jason Foley, Ryan Lowe
Dynamic Stress Measurements of Electronic Devices during Active OperationFull-text access may be available. Sign in or learn about subscription options.pp. 507-512
by Markus Feißt, Eike Möeller, Jüergen Wilde
Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics PackageFull-text access may be available. Sign in or learn about subscription options.pp. 513-519
by Aurore Quelennec, Umar Shafique, Éric Duchesne, Hélène Frémont, Dominique Drouin
Nondestructive, In Situ Mapping of Die Surface Displacements in Encapsulated IC Chip Packages Using X-Ray Diffraction Imaging TechniquesFull-text access may be available. Sign in or learn about subscription options.pp. 520-525
by N. E. Gorji, B. K. Tanner, R. K. Vijayaraghavan, A. N. Danilewsky, P. J. McNally
Low Loss Channel-Shuffling Polymer Waveguides: Design and FabricationFull-text access may be available. Sign in or learn about subscription options.pp. 526-531
by Kohei Abe, Yutaro Oizumi, Yoichi Taira, Takaaki Ishigure
A Very High-Dense on-Board Optical Module Realizing >1.3 Tb/s/Inch ^2Full-text access may be available. Sign in or learn about subscription options.pp. 532-537
by Kazuya Nagashima, Toshinori Uemura, Atsushi Izawa, Yozo Ishikawa, Hideyuki Nasu
Design and Demonstration of a Photonic Integrated Glass Interposer for Mid-Board-Optical EnginesFull-text access may be available. Sign in or learn about subscription options.pp. 538-544
by Marcel Neitz, Markus Wöhrmann, Ruiyong Zhang, Mohamed Fikry, Sebastian Marx, Henning Schröder
Optoelectronic Chip Assembly Process of Optical MCMFull-text access may be available. Sign in or learn about subscription options.pp. 545-550
by Masao Tokunari, Koji Masuda, Hsiang-Han Hsu, Takashi Hisada, Shigeru Nakagawa, Richard Langlois, Patrick Jacques, Paul Fortier
3D Packaging of Embedded Opto-Electronic Die and CMOS IC Based on Wet Etched Silicon InterposerFull-text access may be available. Sign in or learn about subscription options.pp. 551-556
by Chenhui Li, Barry Smalbrugge, Teng Li, Ripalta Stabile, Oded Raz
Self-Alignment with Copper Pillars Micro-Bumps for Positioning Optical Devices at Submicronic AccuracyFull-text access may be available. Sign in or learn about subscription options.pp. 557-562
by Yézouma D. Zonou, Stéphane Bernabe, Daivid Fowler, Mireille Francou, Olivier Castany, Philippe Arguel, Olivier Castany
Thermal Management Characterization of Microassemblied High Power Distributed-Feedback Broad Area Lasers Emitting at 975nmFull-text access may be available. Sign in or learn about subscription options.pp. 563-574
by R. Mostallino, M. Garcia, Y. Deshayes, A. Larrue, Y. Robert, E. Vinet, M. Lecomte, O. Parillaud, M. Krakowski, L. Bechou
28nm CPI (Chip/Package Interactions) in Large Size eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level PackagesFull-text access may be available. Sign in or learn about subscription options.pp. 581-586
by Kang Chen, Linda Chua, Won Kyung Choi, Seng Guan Chow, Seung Wook Yoon
Multi DOE Study on 28nm (RF) WLP Package to Investigate BLR Performance of Large WLP Die with 0.35mm Ball Pitch ArrayFull-text access may be available. Sign in or learn about subscription options.pp. 587-594
by Rey Alvarado, Beth Keser, Tong Cui, Ahmer Syed, Steven Xu, Brian Roggeman
Warpage and Thermal Characterization of Fan-Out Wafer-Level PackagingFull-text access may be available. Sign in or learn about subscription options.pp. 595-602
by John Lau, Ming Li, Dewen Tian, Nelson Fan, Eric Kuah, Wu Kai, Margie Li, J. Hao, Ken Cheung, Zhang Li, Kim Hwee Tan, Rozalia Beica, Cheng-Ta Ko, Yu-Hua Chen, Sze Pei Lim, Ning Cheng Lee, Koh Sau Wee, Jiang Ran, Cao Xi
A Novel 3D IC Wafer-Level-Package for New Wave MEMSFull-text access may be available. Sign in or learn about subscription options.pp. 603-608
by Che-Hau Huang, Sebastian Schuler-Wakins, Ying-Te Ou, Yung-Hui Wang, Ralf Reichenbach, David Polityko, Uwe Hansen
First Demonstration of Photoresist Cleaning for Fine-Line RDL Yield Enhancement by an Innovative Ozone Treatment Process for Panel Fan-Out and InterposersFull-text access may be available. Sign in or learn about subscription options.pp. 609-614
by Atul Gupta, Eric Snyder, Christiane Gottschalk, Kevin Wenzel, James Gunn, Hao Lu, Yuya Suzuki, Venky Sundaram, Rao Tummala
Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-PackageFull-text access may be available. Sign in or learn about subscription options.pp. 615-622
by Vempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong, Sharon Lim PS, Daniel Ismael, Ye Yong Liang
A Versatile Platform towards High Reliability Compact Package for Digital ChipsFull-text access may be available. Sign in or learn about subscription options.pp. 623-630
by C. Ferrandon, L. Castagné, B. Kholti, G. Waltener, R. Lemaire, V. Puyal, J-C. Souriau, G. Simon, J-P. Peltier, T. Lacrevaz, L. Toffanin
Glass Based 3D-IPD Integrated RF ASIC in WLCSPFull-text access may be available. Sign in or learn about subscription options.pp. 631-636
by Teck Chong Lee, Yung-Shun Chang, Che-Ming Hsu, Sheng-Chi Hsieh, Pao-Nan Lee, Yu-Chang Hsieh, Long-Ching Wang, Lijuan Zhang
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous IntegrationFull-text access may be available. Sign in or learn about subscription options.pp. 637-642
by Yu-Tao Yang, Ting-Yang Yu, Shu-Chiao Kuo, Tai-Yuan Huang, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, Kuan-Neng Chen
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