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2004 International Conferce on Test

Oct. 26 2004 to Oct. 28 2004

Charlotte, NC, USA

ISSN: 1089-3539

ISBN: 0-7803-8581-0

Table of Contents

In Memoriam Nathaniel "Ned" KornfieldFreely available from IEEE.pp. 4-4
ITC 2003 Paper AwardsFreely available from IEEE.pp. 5-5
ITC 2004 - Technical Program CommitteeFreely available from IEEE.pp. 6-8
ITC technical paper evaluation and selection processFull-text access may be available. Sign in or learn about subscription options.pp. 10-10
International Test Conference 2005 - Call for PapersFreely available from IEEE.pp. 11-11
Test in the era of "What you see is not what you get" - Keynote addressFull-text access may be available. Sign in or learn about subscription options.pp. 12-12
New test paradigms for yield and manufacturability - Invited addressFull-text access may be available. Sign in or learn about subscription options.pp. 13-13
TTTC: Test Technology Technical CouncilFreely available from IEEE.pp. 14-16
AC IO loopback design for high speed /spl mu/processor IO testFull-text access may be available. Sign in or learn about subscription options.pp. 23-30
Cover
International Test Conference - Title PageFreely available from IEEE.pp. i
Cover
International Test Conference - CopyrightFreely available from IEEE.pp. iv
Introduction
Welcoming MessageFreely available from IEEE.pp. 1
Efficient pattern mapping for deterministic logic BISTFull-text access may be available. Sign in or learn about subscription options.pp. 48-56
Introduction
Steering Committee and SubcommitteesFreely available from IEEE.pp. 2
Introduction
Ned Kornfield MemorialFreely available from IEEE.pp. 4
Logic BIST with scan chain segmentationFull-text access may be available. Sign in or learn about subscription options.pp. 57-66
Introduction
2003 Paper AwardsFull-text access may be available. Sign in or learn about subscription options.pp. 5
Spectral analysis for statistical response compaction during built-in self-testingFull-text access may be available. Sign in or learn about subscription options.pp. 67-76
Introduction
Technical Program CommitteeFreely available from IEEE.pp. 6
Experimental results for high-speed jitter measurement techniqueFull-text access may be available. Sign in or learn about subscription options.pp. 85-94
Introduction
ITC Technical Paper Evaluation and Selection ProcessFreely available from IEEE.pp. 10
An automated, complete, structural test solution for SERDESFull-text access may be available. Sign in or learn about subscription options.pp. 95-104
Introduction
2005 Call for PapersFreely available from IEEE.pp. 11
Introduction
TTTC: Test Technology Technical CouncilFreely available from IEEE.pp. 14
A design for test technique for parametric analysis of SRAM: on-die low yield analysisFull-text access may be available. Sign in or learn about subscription options.pp. 105-113
Detecting faults in the peripheral circuits and an evaluation of SRAM testsFull-text access may be available. Sign in or learn about subscription options.pp. 114-123
Introduction
Technical Paper ReviewersFreely available from IEEE.pp. 17
SESSION 1: PLENARY
Test In the Era of "What You see Is NOT What You Get"Freely available from IEEE.pp. 12
MRAM defect analysis and fault modelingFull-text access may be available. Sign in or learn about subscription options.pp. 124-133
SESSION 1: PLENARY
New Test Paradigms for Yield and ManufacturabilityFull-text access may be available. Sign in or learn about subscription options.pp. 13
CMOS IC diagnostics using the luminescence of off-state leakage currentsFull-text access may be available. Sign in or learn about subscription options.pp. 134-139
SESSION 2: MICROPROCESSOR TEST
AC IO Loopback Design for High Speed uProcessor IO TestFull-text access may be available. Sign in or learn about subscription options.pp. 23-30
A novel scan chain diagnostics technique based on light emission from leakage currentFull-text access may be available. Sign in or learn about subscription options.pp. 140-147
SESSION 2: MICROPROCESSOR TEST
On Correlating Structural Tests with Functional Tests for Speed Binning of High Performance DesignFull-text access may be available. Sign in or learn about subscription options.pp. 31-37
Impact of negative bias temperature instability on product parametric driftFull-text access may be available. Sign in or learn about subscription options.pp. 148-155
SESSION 2: MICROPROCESSOR TEST
An Optimized DFT and Test Pattern Generation Strategy for an Intel High Performance MicroprocessorFull-text access may be available. Sign in or learn about subscription options.pp. 38-47
At-speed interconnect test and diagnosis of external memories on a systemFull-text access may be available. Sign in or learn about subscription options.pp. 156-162
SESSION 3: LOGIC BIST
EFFICIENT PATTERN MAPPING FOR DETERMINISTIC LOGIC BISTFull-text access may be available. Sign in or learn about subscription options.pp. 48-56
Interconnect test pattern generation algorithm for meeting device and global SSO limits with safe initial vectorsFull-text access may be available. Sign in or learn about subscription options.pp. 163-172
SESSION 3: LOGIC BIST
Logic BISTWith Scan Chain SegmentationFull-text access may be available. Sign in or learn about subscription options.pp. 57-66
Removing JTAG bottlenecks in system interconnect testFull-text access may be available. Sign in or learn about subscription options.pp. 173-180
SESSION 3: LOGIC BIST
Spectral Analysis for Statistical Response Compaction During Built-In Self-TestingFull-text access may be available. Sign in or learn about subscription options.pp. 67-76
ATE data collection - a comprehensive requirements proposal to maximize ROI of testFull-text access may be available. Sign in or learn about subscription options.pp. 181-189
Divide and conquer based Fast Shmoo algorithmsFull-text access may be available. Sign in or learn about subscription options.pp. 197-202
SESSION 4: BIST FOR JITTER
Experimental Results for High-Speed Jitter Measurement TechniqueFull-text access may be available. Sign in or learn about subscription options.pp. 85-94
SESSION 4: BIST FOR JITTER
An Automated, Complete, Structural Test Solution for SERDESFull-text access may be available. Sign in or learn about subscription options.pp. 95-104
On hazard-free patterns for fine-delay fault testingFull-text access may be available. Sign in or learn about subscription options.pp. 213-222
SESSION 5: MEMORY TESTING
A Design for Test Technique for Parametric Analysis of SRAM: On-Die Low Yield AnalysisFull-text access may be available. Sign in or learn about subscription options.pp. 105-113
SESSION 5: MEMORY TESTING
DETECTING FAULTS IN THE PERIPHERAL CIRCUITS AND AN EVALUATION OF SRAM TESTSFull-text access may be available. Sign in or learn about subscription options.pp. 114-123
K longest paths per gate (KLPG) test generation for scan-based sequential circuitsFull-text access may be available. Sign in or learn about subscription options.pp. 223-231
SESSION 5: MEMORY TESTING
MRAM Defect Analysis and Fault ModeliFull-text access may be available. Sign in or learn about subscription options.pp. 124-133
A critical path selection method for delay testingFull-text access may be available. Sign in or learn about subscription options.pp. 232-241
SESSION 6: FAILURE CHARACTERIZATION METHODS FOR IC DIAGNOSIS
CMOS IC diagnostics using the luminescence of OFF-state leakage currentsFull-text access may be available. Sign in or learn about subscription options.pp. 134-139
Evaluating the effectiveness of detecting delay defects in the slack interval: a simulation studyFull-text access may be available. Sign in or learn about subscription options.pp. 242-251
SESSION 6: FAILURE CHARACTERIZATION METHODS FOR IC DIAGNOSIS
A Novel Scan Chain Diagnostics Technique Based on Light Emission from Leakage CurrentFull-text access may be available. Sign in or learn about subscription options.pp. 140-147
Quasi-oscillation based test for improved prediction of analog performance parametersFull-text access may be available. Sign in or learn about subscription options.pp. 252-261
SESSION 6: FAILURE CHARACTERIZATION METHODS FOR IC DIAGNOSIS
IMPACT OF NEGATIVE BIAS TEMPERATURE INSTABILITY ON PRODUCT PARAMETRIC DRIFTFull-text access may be available. Sign in or learn about subscription options.pp. 148-155
On-chip impulse response generation for analog and mixed-signal testingFull-text access may be available. Sign in or learn about subscription options.pp. 262-270
SESSION 7: BOARD AND SYSTEM TEST: AT-SPEED AND BOUNCE-FREE
At-Speed Interconnect Test and Diagnosis of External Memories on a SystemFull-text access may be available. Sign in or learn about subscription options.pp. 156-162
Automatic linearity (IP3) test with built-in pattern generator and analyzerFull-text access may be available. Sign in or learn about subscription options.pp. 271-280
SESSION 7: BOARD AND SYSTEM TEST: AT-SPEED AND BOUNCE-FREE
Interconnect Test Pattern Generation Algorithm For Meeting Device and Global SSO Limits With Safe Initial VectorsFull-text access may be available. Sign in or learn about subscription options.pp. 163-172
Extending the digital core-based test methodology to support mixed-signalFull-text access may be available. Sign in or learn about subscription options.pp. 281-289
SESSION 7: BOARD AND SYSTEM TEST: AT-SPEED AND BOUNCE-FREE
Removing JTAG Bottlenecks in System Interconnect TestFull-text access may be available. Sign in or learn about subscription options.pp. 173-180
Systematic defects in deep sub-micron technologiesFull-text access may be available. Sign in or learn about subscription options.pp. 290-299
SESSION 8: METHODS AND STRATEGIES FOR OPTIMAL TEST
ATE Data Collection - A comprehensive requirements proposal to maximize ROI of testFull-text access may be available. Sign in or learn about subscription options.pp. 181-189
Minimum testing requirements to screen temperature dependent defectsFull-text access may be available. Sign in or learn about subscription options.pp. 300-308
SESSION 8: METHODS AND STRATEGIES FOR OPTIMAL TEST
NON-DETERMINISTIC DUT BEHAVIOR DURING FUNCTIONAL TESTING OF HIGH SPEED SERIAL BUSSES: CHALLENGES AND SOLUTIONSFull-text access may be available. Sign in or learn about subscription options.pp. 190-196
Random and systematic defect analysis using IDDQ signature analysis for understanding fails and guiding test decisionsFull-text access may be available. Sign in or learn about subscription options.pp. 309-318
SESSION 8: METHODS AND STRATEGIES FOR OPTIMAL TEST
Divide and Conquer based Fast Shmoo algorithmsFull-text access may be available. Sign in or learn about subscription options.pp. 197-202
Defect detection under realistic leakage models using multiple I/sub DDQ/ measurementsFull-text access may be available. Sign in or learn about subscription options.pp. 319-328
SESSION 8: METHODS AND STRATEGIES FOR OPTIMAL TEST
IN SEARCH OF THE OPTIMUM TEST SET - ADAPTIVE TEST METHODS FOR MAXIMUM DEFECT COVERAGE AND LOWEST TEST COSTFull-text access may be available. Sign in or learn about subscription options.pp. 203-212
Testing micropipelined asynchronous circuitsFull-text access may be available. Sign in or learn about subscription options.pp. 329-338
SESSION 9: IN SEARCH OF SMALL DELAY DEFECTS
On Hazard-free Patterns for Fine-delay Fault TestingFull-text access may be available. Sign in or learn about subscription options.pp. 213-222
Scan based side channel attack on dedicated hardware implementations of Data Encryption StandardFull-text access may be available. Sign in or learn about subscription options.pp. 339-344
A holistic parallel and hierarchical approach towards design-for-testFull-text access may be available. Sign in or learn about subscription options.pp. 345-354
SESSION 9: IN SEARCH OF SMALL DELAY DEFECTS
K Longest Paths Per Gate (KLPG) Test Generation for Scan-Based Sequential CircuitsFull-text access may be available. Sign in or learn about subscription options.pp. 223-231
Minimizing power consumption in scan testing: pattern generation and DFT techniquesFull-text access may be available. Sign in or learn about subscription options.pp. 355-364
SESSION 9: IN SEARCH OF SMALL DELAY DEFECTS
A Critical Path Selection Method for Delay TestingFull-text access may be available. Sign in or learn about subscription options.pp. 232-241
A new probing technique for high-speed/high-density printed circuit boardsFull-text access may be available. Sign in or learn about subscription options.pp. 365-374
SESSION 9: IN SEARCH OF SMALL DELAY DEFECTS
Evaluating the Effectiveness of Detecting Delay Defects in the Slack Interval: A Simulation StudyFull-text access may be available. Sign in or learn about subscription options.pp. 242-251
On-chip mixed-signal test structures re-used for board testFull-text access may be available. Sign in or learn about subscription options.pp. 375-383
SESSION 10: MIXED-SIGNAL BIST AND DFT
Quasi-Oscillation Based Test for Improved Prediction of Analog Performance ParametersFull-text access may be available. Sign in or learn about subscription options.pp. 252-261
Test strategy cost model innovationsFull-text access may be available. Sign in or learn about subscription options.pp. 384-392
SESSION 10: MIXED-SIGNAL BIST AND DFT
On-Chip Impulse Response Generation for Analog and Mixed-Signal TestingFull-text access may be available. Sign in or learn about subscription options.pp. 262-270
SESSION 10: MIXED-SIGNAL BIST AND DFT
AUTOMATIC LINEARITY (IP3) TEST WITH BUILT-IN PATTERN GENERATOR AND ANALYZERFull-text access may be available. Sign in or learn about subscription options.pp. 271-280
Production test effectiveness of combined automated inspection and ICT test strategiesFull-text access may be available. Sign in or learn about subscription options.pp. 393-402
SESSION 10: MIXED-SIGNAL BIST AND DFT
Extending the Digital Core-based Test Methodology to Support Mixed-SignalFull-text access may be available. Sign in or learn about subscription options.pp. 281-289
Open architecture test system: system architecture and designFull-text access may be available. Sign in or learn about subscription options.pp. 403-412
SESSION 11: ADVANCES IN TESTING FOR DEFECTS
Systematic Defects in Deep Sub-Micron TechnologiesFull-text access may be available. Sign in or learn about subscription options.pp. 290-299
Test programming environment in a modular, open architecture test systemFull-text access may be available. Sign in or learn about subscription options.pp. 413-422
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