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2015 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)

June 6 2015 to June 6 2015

San Francisco, CA, USA

Table of Contents

CopyrightFreely available from IEEE.pp. 1-1
SI for free: machine learning of interconnect coupling delay and transition effectsFull-text access may be available. Sign in or learn about subscription options.pp. 1-8
Smart I/Os: a data-pattern aware 2.5D interconnect with space-time multiplexingFull-text access may be available. Sign in or learn about subscription options.pp. 1-6
Clock clustering and IO optimization for 3D integrationFull-text access may be available. Sign in or learn about subscription options.pp. 1-8
On fast timing closure: speeding up incremental path-based timing analysis with mapreduceFull-text access may be available. Sign in or learn about subscription options.pp. 1-6
Power line communication for hybrid power/signal pin SOC designFull-text access may be available. Sign in or learn about subscription options.pp. 1-8
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