1. Home
  2. Proceedings
  3. TECHDEBT
  4. TECHDEBT 2020
Default Cover Image

2020 IEEE/ACM International Conference on Technical Debt (TechDebt)

May 25 2020 to May 26 2020

Seoul, Korea, Republic of

ISBN: 978-1-4503-7960-1

Table of Contents

Title Page iFreely available from IEEE.pp. 1-1
Title Page iiiFreely available from IEEE.pp. 3-3
Table of ContentsFreely available from IEEE.pp. 5-7
About TechDebt 2020Freely available from IEEE.pp. 8-8
About the KeynotesFreely available from IEEE.pp. 9-10
Organizing Committee and Program CommitteeFreely available from IEEE.pp. 11-12
A Systematic Literature Review of Technical Debt PrioritizationFull-text access may be available. Sign in or learn about subscription options.pp. 1-10
by Reem Alfayez, Wesam Alwehaibi, Robert Winn, Elaine Venson, Barry Boehm
An Empirical Study on Self-Fixed Technical DebtFull-text access may be available. Sign in or learn about subscription options.pp. 11-20
by Jie Tan, Daniel Feitosa, Paris Avgeriou
Carrot and Stick approaches when managing Technical DebtFull-text access may be available. Sign in or learn about subscription options.pp. 21-30
by Terese Besker, Antonio Martini, Jan Bosch
Detecting Bad Smells with Machine Learning Algorithms: an Empirical StudyFull-text access may be available. Sign in or learn about subscription options.pp. 31-40
by Daniel Cruz, Amanda Santana, Eduardo Figueiredo
Experiences with Technical Debt and Management Strategies in Production Systems EngineeringFull-text access may be available. Sign in or learn about subscription options.pp. 41-50
by Laura Waltersdorfer, Felix Rinker, Lukas Kathrein, Stefan Biffl
How Junior Developers Deal with Their Technical Debt?Full-text access may be available. Sign in or learn about subscription options.pp. 51-61
by Fabian Gilson, Miguel Morales-Trujillo, Moffat Mathews
On Energy Debt : Managing Consumption on Evolving SoftwareFull-text access may be available. Sign in or learn about subscription options.pp. 62-66
by Marco Couto, Daniel Maia, João Saraiva, Rui Pereira
The Hidden Cost of Backward Compatibility: When Deprecation Turns into Technical Debt - An Experience ReportFull-text access may be available. Sign in or learn about subscription options.pp. 67-76
by Anders Sundelin, Javier Gonzalez-Huerta, Krzysztof Wnuk
The Prevalence of the Technical Debt Concept in Serbian IT Industry: Results of a National-Wide SurveyFull-text access may be available. Sign in or learn about subscription options.pp. 77-86
by Vladimir Mandić, Nebojša Taušan, Robert Ramač
Towards Collaborative Technical Debt Management in Systems of SystemsFull-text access may be available. Sign in or learn about subscription options.pp. 87-91
by Johann Schütz, Jorge Marx Gómez
Towards Microservice Smells DetectionFull-text access may be available. Sign in or learn about subscription options.pp. 92-97
by Ilaria Pigazzini, Francesca Arcelli Fontana, Valentina Lenarduzzi, Davide Taibi
Trade-offs in Managing Risk and Technical Debt in Industrial Research Labs: An Experience ReportFull-text access may be available. Sign in or learn about subscription options.pp. 98-102
by François Gauthier, Alexander Jordan, Padmanabhan Krishnan, Behnaz Hassanshahi, Jörn Guy Süß, Sora Bae, Hyunjun Lee
What are the Practices used by Software Practitioners on Technical Debt Payment? Results From an International Family of SurveysFull-text access may be available. Sign in or learn about subscription options.pp. 103-112
by Boris Pérez, Camilo Castellanos, Darío Correal, Nicolli Rios, Sávio Freire, Rodrigo Spínola, Carolyn Seaman
Skuld: A self-learning tool for impact-driven technical debt managementFull-text access may be available. Sign in or learn about subscription options.pp. 113-114
by Josep Burgaya Pujols, Pieter Bas, Silverio Martínez-Fernández, Antonio Martini, Adam Trendowicz
Software Archinaut: A Tool to Understand Architecture, Identify Technical Debt Hotspots and Manage Evolution : Tool Presentation PaperFull-text access may be available. Sign in or learn about subscription options.pp. 115-119
by Humberto Cervantes, Rick Kazman
Author IndexFreely available from IEEE.pp. 121-121
Showing 22 out of 22