Default Cover Image

Proceedings of International Test Conference

Oct. 2 1995 to Oct. 6 1994

Washington, DC, USA

Table of Contents

Proceedings International Test Conference 1994Full-text access may be available. Sign in or learn about subscription options.pp. ii-xi
Development of a solution for achieving known-good-dieFull-text access may be available. Sign in or learn about subscription options.pp. 15-21
Membrane probe technology for MCM Known-Good-DieFull-text access may be available. Sign in or learn about subscription options.pp. 22,23,24,25,26,27,28,29
High yield multichip modules based on minimal IC pretestFull-text access may be available. Sign in or learn about subscription options.pp. 30,31,32,33,34,35,36,37,38,39,40
Feasibility study of smart substrate multichip modulesFull-text access may be available. Sign in or learn about subscription options.pp. 41,42,43,44,45,46,47,48,49
Testability strategy of the Alpha AXP 21164 microprocessorFull-text access may be available. Sign in or learn about subscription options.pp. 50,51,52,53,54,55,56,57,58,59
Testability features of the MC68060 microprocessorFull-text access may be available. Sign in or learn about subscription options.pp. 60,61,62,63,64,65,66,67,68,69
MicroSPARC: a case-study of scan based debugFull-text access may be available. Sign in or learn about subscription options.pp. 70,71,72,73,74,75
Balancing structured and ad-hoc design for test: testing of the PowerPC 603 microprocessorFull-text access may be available. Sign in or learn about subscription options.pp. 76,77,78,79,80,81,82,83
System test cost modelling based on event rate analysisFull-text access may be available. Sign in or learn about subscription options.pp. 84,85,86,87,88,89,90,91,92
ASIC test cost/strategy trade-offsFull-text access may be available. Sign in or learn about subscription options.pp. 93,94,95,96,97,98,99,100,101,102
A test process optimization and cost modeling toolFull-text access may be available. Sign in or learn about subscription options.pp. 103,104,105,106,107,108,109,110
When does it make C to give up physical test access?Full-text access may be available. Sign in or learn about subscription options.pp. 111,112,113,114,115,116,117,118,119
3B21D BIST/Boundary-Scan system diagnostic test storyFull-text access may be available. Sign in or learn about subscription options.pp. 120,121,122,123,124,125,126
Modeling for structured system interconnect testFull-text access may be available. Sign in or learn about subscription options.pp. 127,128,129,130,131,132,133
System-level testability of hardware/software systemsFull-text access may be available. Sign in or learn about subscription options.pp. 134,135,136,137,138,139,140,141,142
Fastpath: a path-delay test generator for standard scan designsFull-text access may be available. Sign in or learn about subscription options.pp. 154-163
On path delay testing in a standard scan environmentFull-text access may be available. Sign in or learn about subscription options.pp. 164,165,166,167,168,169,170,171,172,173
Automated logic synthesis of random pattern testable circuitsFull-text access may be available. Sign in or learn about subscription options.pp. 174,175,176,177,178,179,180,181,182,183
Transforming behavioral specifications to facilitate synthesis of testable designsFull-text access may be available. Sign in or learn about subscription options.pp. 184,185,186,187,188,189,190,191,192,193
QTAG: a standard for test fixture based I/sub DDQ//I/sub SSQ/ monitorsFull-text access may be available. Sign in or learn about subscription options.pp. 194,195,196,197,198,199,200,201,202
An off-chip IDDq current measurement unit for telecommunication ASICsFull-text access may be available. Sign in or learn about subscription options.pp. 203,204,205,206,207,208,209,210,211,212
Development of a class 1 QTAG monitorFull-text access may be available. Sign in or learn about subscription options.pp. 213,214,215,216,217,218,219,220,221,222
A serially addressable, flexible current monitor for test fixture based I/sub DDQ//I/sub SSQ/ testingFull-text access may be available. Sign in or learn about subscription options.pp. 223,224,225,226,227,228,229,230,231,232
On the initialization of sequential circuitsFull-text access may be available. Sign in or learn about subscription options.pp. 233,234,235,236,237,238,239
An automatic test pattern generator for large sequential circuits based on Genetic AlgorithmsFull-text access may be available. Sign in or learn about subscription options.pp. 240-249
ATPG for heat dissipation minimization during test applicationFull-text access may be available. Sign in or learn about subscription options.pp. 250,251,252,253,254,255,256,257,258
Sequentially untestable faults identified without search ("simple implications beat exhaustive search!")Full-text access may be available. Sign in or learn about subscription options.pp. 259,260,261,262,263,264,265,266
Implementation of a dual segment architecture for a high pin count VLSI test systemFull-text access may be available. Sign in or learn about subscription options.pp. 267,268,269,270,271,272
500 MHz testing on a 100 MHz testerFull-text access may be available. Sign in or learn about subscription options.pp. 273,274,275,276,277,278
Modeling the effect of ground bounce on noise marginFull-text access may be available. Sign in or learn about subscription options.pp. 279,280,281,282,283,284,285
Modular mixed signal testing: high speed or high resolutionFull-text access may be available. Sign in or learn about subscription options.pp. 286,287,288,289,290
Built-in system test and fault locationFull-text access may be available. Sign in or learn about subscription options.pp. 291,292,293,294,295,296,297,298,299
Roadmap for extending IEEE 1149.1 for hierarchical control of locally-stored, standardized command set, test programsFull-text access may be available. Sign in or learn about subscription options.pp. 300,301,302,303,304,305,306
Environmental Stress Testing with Boundary-ScanFull-text access may be available. Sign in or learn about subscription options.pp. 307,308,309,310,311,312,313
An approach to accelerate scan testing in IEEE 1149.1 architecturesFull-text access may be available. Sign in or learn about subscription options.pp. 314,315,316,317,318,319,320,321,322
Multi-frequency, multi-phase scan chainFull-text access may be available. Sign in or learn about subscription options.pp. 323,324,325,326,327,328,329,330
A test clock reduction method for scan-designed circuitsFull-text access may be available. Sign in or learn about subscription options.pp. 331,332,333,334,335,336,337,338,339
Hybrid design for testability combining scan and clock line control and method for test generationFull-text access may be available. Sign in or learn about subscription options.pp. 340,341,342,343,344,345,346,347,348,349
In-system timing extraction and control through scan-based, test-access portsFull-text access may be available. Sign in or learn about subscription options.pp. 350,351,352,353,354,355,356,357,358,359
Testing 256k word/spl times/16 bit Cache DRAM (CDRAM)Full-text access may be available. Sign in or learn about subscription options.pp. 360
Testing high speed DRAMsFull-text access may be available. Sign in or learn about subscription options.pp. 361
Practical test methods for verification of the EDRAMFull-text access may be available. Sign in or learn about subscription options.pp. 362
Testing issues on high speed synchronous DRAMsFull-text access may be available. Sign in or learn about subscription options.pp. 363
BenchmarkingFull-text access may be available. Sign in or learn about subscription options.pp. 364
Potential solutions for benchmarking issuesFull-text access may be available. Sign in or learn about subscription options.pp. 365
Multichip module testing methodologies: what's in; what's notFull-text access may be available. Sign in or learn about subscription options.pp. 366
MCM test trade-offsFull-text access may be available. Sign in or learn about subscription options.pp. 367
Aliasing-free signature analysis for RAM BISTFull-text access may be available. Sign in or learn about subscription options.pp. 368,369,370,371,372,373,374,375,376,377
An effective BIST scheme for ring-address type FIFOsFull-text access may be available. Sign in or learn about subscription options.pp. 378,379,380,381,382,383,384,385,386,387
The PowerPC 603 microprocessor: an array built-in self test mechanismFull-text access may be available. Sign in or learn about subscription options.pp. 388,389,390,391,392,393,394
Testing CMOS logic gates for: realistic shortsFull-text access may be available. Sign in or learn about subscription options.pp. 395,396,397,398,399,400,401,402
A study of I/sub DDQ/ subset selection algorithms for bridging faultsFull-text access may be available. Sign in or learn about subscription options.pp. 403,404,405,406,407,408,409,410,411,412
Defect classes-an overdue paradigm for CMOS IC testingFull-text access may be available. Sign in or learn about subscription options.pp. 413,414,415,416,417,418,419,420,421,422,423,424,425
A test methodology to support an ASEM MCM foundryFull-text access may be available. Sign in or learn about subscription options.pp. 426,427,428,429,430,431,432,433,434,435
Test strategies for a family of complex MCMsFull-text access may be available. Sign in or learn about subscription options.pp. 436,437,438,439,440,441,442,443,444,445
Designing "dual personality" IEEE 1149.1 compliant multi-chip modulesFull-text access may be available. Sign in or learn about subscription options.pp. 446,447,448,449,450,451,452,453,454,455
A case-study in the use of scan in microSPARC testing and debugFull-text access may be available. Sign in or learn about subscription options.pp. 456,457,458,459,460
A hierarchical environment for interactive test engineeringFull-text access may be available. Sign in or learn about subscription options.pp. 461,462,463,464,465,466,467,468,469,470
Ensuring system traceability to international standardsFull-text access may be available. Sign in or learn about subscription options.pp. 471,472,473,474,475,476,477,478,479,480
GLFSR-a new test pattern generator for built-in-self-testFull-text access may be available. Sign in or learn about subscription options.pp. 481,482,483,484,485,486,487,488,489,490
Design of an efficient weighted random pattern generation systemFull-text access may be available. Sign in or learn about subscription options.pp. 491,492,493,494,495,496,497,498,499,500
Efficient test response compression for multiple-output circuitsFull-text access may be available. Sign in or learn about subscription options.pp. 501,502,503,504,505,506,507,508,509,510
ECC-on-SIMM test challengesFull-text access may be available. Sign in or learn about subscription options.pp. 511-515
Techniques for characterizing DRAMs with a 500 MHz interfaceFull-text access may be available. Sign in or learn about subscription options.pp. 516,517,518,519,520,521,522,523,524,525
Automatic failure analysis system for high density DRAMFull-text access may be available. Sign in or learn about subscription options.pp. 526,527,528,529,530
Detection and correction of systematic type I test errors through concurrent engineeringFull-text access may be available. Sign in or learn about subscription options.pp. 531,532,533,534,535,536,537,538
Defects, fault coverage, yield and cost, in board manufacturingFull-text access may be available. Sign in or learn about subscription options.pp. 539,540,541,542,543,544,545,546,547
HALT: bridging the gap between theory and practiceFull-text access may be available. Sign in or learn about subscription options.pp. 548,549,550,551,552,553,554
Residual charge on the faulty floating gate CMOS transistorFull-text access may be available. Sign in or learn about subscription options.pp. 555,556,557,558,559,560,561
Variable supply voltage testing for analogue CMOS and bipolar circuitsFull-text access may be available. Sign in or learn about subscription options.pp. 562,563,564,565,566,567,568,569,570,571
Is I/sub DDQ/ yield loss inevitable?Full-text access may be available. Sign in or learn about subscription options.pp. 572,573,574,575,576,577,578,579
A software architecture for mixed signal functional testingFull-text access may be available. Sign in or learn about subscription options.pp. 580,581,582,583,584,585,586
A procedural interface to testFull-text access may be available. Sign in or learn about subscription options.pp. 587,588,589,590,591,592,593
An intelligent software-integrated environment of IC testFull-text access may be available. Sign in or learn about subscription options.pp. 594,595,596,597,598,599,600,601,602,603
Parallel pattern fast fault simulation for three-state circuits and bidirectional I/OFull-text access may be available. Sign in or learn about subscription options.pp. 604,605,606,607,608,609,610,611,612,613
A hybrid fault simulator for synchronous sequential circuitsFull-text access may be available. Sign in or learn about subscription options.pp. 614,615,616,617,618,619,620,621,622,623
Reduced scan shift: a new testing method for sequential circuitsFull-text access may be available. Sign in or learn about subscription options.pp. 624,625,626,627,628,629,630
An integrated approach for analog circuit testing with a minimum number of detected parametersFull-text access may be available. Sign in or learn about subscription options.pp. 631,632,633,634,635,636,637,638,639,640
Analogue fault simulation based on layout dependent fault modelsFull-text access may be available. Sign in or learn about subscription options.pp. 641,642,643,644,645,646,647,648,649
An analog multi-tone signal generator for built-in-self-test applicationsFull-text access may be available. Sign in or learn about subscription options.pp. 650,651,652,653,654,655,656,657,658,659
Low power mode and IEEE 1149.1 compliance: a low power solutionFull-text access may be available. Sign in or learn about subscription options.pp. 660,661,662,663,664,665,666,667,668,669
An I/sub DDQ/ based built-in concurrent test technique for interconnects in a boundary scan environmentFull-text access may be available. Sign in or learn about subscription options.pp. 670,671,672,673,674,675,676
Fault injection boundary scan design for verification of fault tolerant systemsFull-text access may be available. Sign in or learn about subscription options.pp. 677,678,679,680,681,682
Ultra hi-speed pin-electronics and test station using GaAs ICFull-text access may be available. Sign in or learn about subscription options.pp. 683,684,685,686,687,688,689,690
Achieving /spl plusmn/30 ps accuracy in the ATE environmentFull-text access may be available. Sign in or learn about subscription options.pp. 691,692,693,694,695,696,697,698,699,700
A test system architecture to reduce transmission line effects during high speed testingFull-text access may be available. Sign in or learn about subscription options.pp. 701,702,703,704,705,706,707,708,709
Application of optoelectronic techniques to high speed testingFull-text access may be available. Sign in or learn about subscription options.pp. 710,711,712,713,714,715,716,717,718,719
Back annotation of physical defects into gate-level, realistic faults in digital ICsFull-text access may be available. Sign in or learn about subscription options.pp. 720,721,722,723,724,725,726,727,728
Simulation results of an efficient defect analysis procedureFull-text access may be available. Sign in or learn about subscription options.pp. 729,730,731,732,733,734,735,736,737,738
The effect on quality of non-uniform fault coverage and fault probabilityFull-text access may be available. Sign in or learn about subscription options.pp. 739,740,741,742,743,744,745,746
Application of joint time-frequency analysis in mixed signal testingFull-text access may be available. Sign in or learn about subscription options.pp. 747,748,749,750,751,752,753,754,755,756
Digitizer error extraction in the nonlinearity testFull-text access may be available. Sign in or learn about subscription options.pp. 757,758,759,760,761,762
An improved method of ADC jitter measurementFull-text access may be available. Sign in or learn about subscription options.pp. 763,764,765,766,767,768,769,770
An on-line data collection and analysis system for VLSI devices at wafer probe and final testFull-text access may be available. Sign in or learn about subscription options.pp. 771,772,773,774,775,776,777,778,779,780
Test station workcell controller and resource relationship designFull-text access may be available. Sign in or learn about subscription options.pp. 781,782,783,784,785,786,787,788,789,790,791,792
Calculating error of measurement on high speed microprocessor testFull-text access may be available. Sign in or learn about subscription options.pp. 793,794,795,796,797,798,799,800,801
Goal-directed vector generation using sample ICsFull-text access may be available. Sign in or learn about subscription options.pp. 802,803,804,805,806,807,808,809,810
NAND trees accurately diagnose board-level pin faultsFull-text access may be available. Sign in or learn about subscription options.pp. 811,812,813,814,815,816
Non-volatile programmable devices and in-circuit testFull-text access may be available. Sign in or learn about subscription options.pp. 817,818,819,820,821,822,823
Showing 100 out of 131